Revision 13 2-99 Table 2-146 RAM512X18 Commercial-Case Conditions: TJ" />
參數(shù)資料
型號(hào): AGLE600V2-FGG256I
廠商: Microsemi SoC
文件頁數(shù): 17/166頁
文件大小: 0K
描述: IC FPGA 1KB FLASH 600K 256-FBGA
標(biāo)準(zhǔn)包裝: 90
系列: IGLOOe
邏輯元件/單元數(shù): 13824
RAM 位總計(jì): 110592
輸入/輸出數(shù): 165
門數(shù): 600000
電源電壓: 1.14 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
IGLOOe Low Power Flash FPGAs
Revision 13
2-99
Table 2-146 RAM512X18
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
Std.
Units
tAS
Address Setup Time
0.83
ns
tAH
Address Hold Time
0.16
ns
tENS
REN, WEN Setup Time
0.73
ns
tENH
REN, WEN Hold Time
0.08
ns
tDS
Input Data (WD) Setup Time
0.71
ns
tDH
Input Data (WD) Hold Time
0.36
ns
tCKQ1
Clock HIGH to New Data Valid on RD (output retained, WMODE = 0)
4.21
ns
tCKQ2
Clock HIGH to New Data Valid on RD (pipelined)
1.71
ns
tC2CRWH1
Address collision clk-to-clk delay for reliable read access after write on
same address; applicable to opening edge
0.35
ns
tC2CWRH1
Address collision clk-to-clk delay for reliable write access after read on
same address; applicable to opening edge
0.42
ns
tRSTBQ
RESET Low to Data Out Low on RD (flow-through)
2.06
ns
RESET Low to Data Out Low on RD (pipelined)
2.06
ns
tREMRSTB
RESET Removal
0.61
ns
tRECRSTB
RESET Recovery
3.21
ns
tMPWRSTB
RESET Minimum Pulse Width
0.68
ns
tCYC
Clock Cycle Time
6.24
ns
FMAX
Maximum Frequency
160
MHz
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
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