2-6 Revision 17 Thermal Characteristics Introduction The temperature variable in the Microsemi " />
參數(shù)資料
型號: AGLN060V2-CSG81
廠商: Microsemi SoC
文件頁數(shù): 66/150頁
文件大?。?/td> 0K
描述: IC FPGA NANO 1KB 60K 81-CSP
標準包裝: 640
系列: IGLOO nano
邏輯元件/單元數(shù): 1536
RAM 位總計: 18432
輸入/輸出數(shù): 60
門數(shù): 60000
電源電壓: 1.14 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -20°C ~ 70°C
封裝/外殼: 81-WFBGA,CSBGA
供應商設(shè)備封裝: 81-CSP(5x5)
IGLOO nano DC and Switching Characteristics
2-6
Revision 17
Thermal Characteristics
Introduction
The temperature variable in the Microsemi Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = T + TA
EQ 1
where:
TA = Ambient temperature
T = Temperature gradient between junction (silicon) and ambient T = ja * P
ja = Junction-to-ambient of the package. ja numbers are located in Figure 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
jc and the junction-to-ambient air thermal resistivity is
ja. The thermal characteristics for ja are shown for two air flow rates. The maximum operating junction
temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
C) Max. ambient temp. (C)
ja(C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
C70C
20.5°C/W
-------------------------------------
1.46 W
=
Table 2-5
Package Thermal Resistivities
Package Type
Pin
Count
jc
ja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
36
TBD
C/W
81
TBD
C/W
Quad Flat No Lead (QFN)
48
TBD
C/W
68
TBD
C/W
100
TBD
C/W
Very Thin Quad Flat Pack (VQFP)
100
10.0
35.3
29.4
27.1
C/W
Table 2-6
Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC = 1.425 V)
For IGLOO nano V2 or V5 Devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
–20°C
0°C
25°C
70°C
85°C
100°C
1.425
0.947
0.956
0.965
0.978
1.000
1.009
1.013
1.5
0.875
0.883
0.892
0.904
0.925
0.932
0.937
1.575
0.821
0.829
0.837
0.848
0.868
0.875
0.879
相關(guān)PDF資料
PDF描述
RMA44DTBS CONN EDGECARD 88POS R/A .125 SLD
RSA44DTAS CONN EDGECARD 88POS R/A .125 SLD
RMA44DTAS CONN EDGECARD 88POS R/A .125 SLD
HSM43DRYN CONN EDGECARD 86POS DIP .156 SLD
HMM43DRYN CONN EDGECARD 86POS DIP .156 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLN060V2-CSG81I 功能描述:IC FPGA NANO 1KB 60K 81-CSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設(shè)備封裝:289-CSP(14x14)
AGLN060V2-VQ100 功能描述:IC FPGA NANO 1KB 60K 100VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設(shè)備封裝:289-CSP(14x14)
AGLN060V2-VQ100I 功能描述:IC FPGA NANO 1KB 60K 100VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設(shè)備封裝:289-CSP(14x14)
AGLN060V2-VQG100 功能描述:IC FPGA NANO 1KB 60K 100VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設(shè)備封裝:289-CSP(14x14)
AGLN060V2-VQG100I 功能描述:IC FPGA NANO 1KB 60K 100VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設(shè)備封裝:289-CSP(14x14)