1-2 Revision 17 Flash Advantages Low Power Flash-based IGLOO nano devices exhibit power characteristics similar " />
參數(shù)資料
型號(hào): AGLN125V5-ZVQ100
廠商: Microsemi SoC
文件頁(yè)數(shù): 129/150頁(yè)
文件大?。?/td> 0K
描述: IC FPGA NANO 1KB 125K 100VQFP
標(biāo)準(zhǔn)包裝: 90
系列: IGLOO nano
邏輯元件/單元數(shù): 3072
RAM 位總計(jì): 36864
輸入/輸出數(shù): 71
門數(shù): 125000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -20°C ~ 70°C
封裝/外殼: 100-TQFP
供應(yīng)商設(shè)備封裝: 100-VQFP(14x14)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)當(dāng)前第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)
IGLOO nano Device Overview
1-2
Revision 17
Flash Advantages
Low Power
Flash-based IGLOO nano devices exhibit power characteristics similar to those of an ASIC, making them
an ideal choice for power-sensitive applications. IGLOO nano devices have only a very limited power-on
current surge and no high-current transition period, both of which occur on many FPGAs.
IGLOO nano devices also have low dynamic power consumption to further maximize power savings;
power is reduced even further by the use of a 1.2 V core voltage.
Low dynamic power consumption, combined with low static power consumption and Flash*Freeze
technology, gives the IGLOO nano device the lowest total system power offered by any FPGA.
Security
Nonvolatile, flash-based IGLOO nano devices do not require a boot PROM, so there is no vulnerable
external bitstream that can be easily copied. IGLOO nano devices incorporate FlashLock, which provides
a unique combination of reprogrammability and design security without external overhead, advantages
that only an FPGA with nonvolatile flash programming can offer.
IGLOO nano devices utilize a 128-bit flash-based lock and a separate AES key to provide the highest
level of security in the FPGA industry for programmed intellectual property and configuration data. In
addition, all FlashROM data in IGLOO nano devices can be encrypted prior to loading, using the
industry-leading AES-128 (FIPS192) bit block cipher encryption standard. AES was adopted by the
National Institute of Standards and Technology (NIST) in 2000 and replaces the 1977 DES standard.
IGLOO nano devices have a built-in AES decryption engine and a flash-based AES key that make them
the most comprehensive programmable logic device security solution available today. IGLOO nano
devices with AES-based security provide a high level of protection for remote field updates over public
networks such as the Internet, and are designed to ensure that valuable IP remains out of the hands of
system overbuilders, system cloners, and IP thieves.
Security, built into the FPGA fabric, is an inherent component of IGLOO nano devices. The flash cells are
located beneath seven metal layers, and many device design and layout techniques have been used to
make invasive attacks extremely difficult. IGLOO nano devices, with FlashLock and AES security, are
unique in being highly resistant to both invasive and noninvasive attacks. Your valuable IP is protected
with industry-standard security, making remote ISP possible. An IGLOO nano device provides the best
available security for programmable logic designs.
Single Chip
Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed, the
configuration data is an inherent part of the FPGA structure, and no external configuration data needs to
be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based IGLOO nano
FPGAs do not require system configuration components such as EEPROMs or microcontrollers to load
device configuration data. This reduces bill-of-materials costs and PCB area, and increases security and
system reliability.
Instant On
Microsemi flash-based IGLOO nano devices support Level 0 of the Instant On classification standard.
This feature helps in system component initialization, execution of critical tasks before the processor
wakes up, setup and configuration of memory blocks, clock generation, and bus activity management.
The Instant On feature of flash-based IGLOO nano devices greatly simplifies total system design and
reduces total system cost, often eliminating the need for CPLDs and clock generation PLLs. In addition,
glitches and brownouts in system power will not corrupt the IGLOO nano device's flash configuration,
and unlike SRAM-based FPGAs, the device will not have to be reloaded when system power is restored.
This enables the reduction or complete removal of the configuration PROM, expensive voltage monitor,
brownout detection, and clock generator devices from the PCB design. Flash-based IGLOO nano
devices simplify total system design and reduce cost and design risk while increasing system reliability
and improving system initialization time.
IGLOO nano flash FPGAs enable the user to quickly enter and exit Flash*Freeze mode. This is done
almost instantly (within 1 s) and the device retains configuration and data in registers and RAM. Unlike
SRAM-based FPGAs, the device does not need to reload configuration and design state from external
memory components; instead it retains all necessary information to resume operation immediately.
相關(guān)PDF資料
PDF描述
AGLN060V5-VQ100I IC FPGA NANO 1KB 60K 100VQFP
AGLN060V5-VQG100I IC FPGA NANO 1KB 60K 100VQFP
A3PN250-1VQ100 IC FPGA NANO 250K GATES 100-VQFP
A3PN250-Z1VQ100 IC FPGA NANO 250K GATES 100-VQFP
BR93L46FV-WE2 IC EEPROM 1KBIT 2MHZ 8SSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLN125V5-ZVQ100I 功能描述:IC FPGA NANO 1KB 125K 100VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN125V5-ZVQG100 功能描述:IC FPGA NANO 1KB 125K 100VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN125V5-ZVQG100I 功能描述:IC FPGA NANO 1KB 125K 100VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN250V2-CSG81 功能描述:IC FPGA 250K 1.2-1.5V CSP81 RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計(jì):226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP(28x28)
AGLN250V2-CSG81I 功能描述:IC FPGA NANO 1KB 250K 81-CSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)