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參數(shù)資料
| 型號(hào)： | AGLP030V5-VQG128 |
| 廠商： | Microsemi SoC |
| 文件頁(yè)數(shù)： | 134/134頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA IGLOO PLUS 30K 128-VQFN |
| 標(biāo)準(zhǔn)包裝： | 90 |
| 系列： | IGLOO PLUS |
| 邏輯元件/單元數(shù)： | 792 |
| 輸入/輸出數(shù)： | 101 |
| 門(mén)數(shù)： | 30000 |
| 電源電壓： | 1.425 V ~ 1.575 V |
| 安裝類(lèi)型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 128-TQFP |
| 供應(yīng)商設(shè)備封裝： | 128-VTQFP（14x14） |
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IGLOO PLUS Low Power Flash FPGAs
Revision 16
3-5
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Related Documents
The following documents provide packaging information and device selection for low power flash
devices.
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
This document contains the package mechanical drawings for all packages currently or previously
supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.
Additional packaging materials are available at
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AGLP030V5-VQG128I | 功能描述:IC FPGA IGLOO PLUS 30K 128-VQFN RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:IGLOO PLUS 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門(mén)數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| AGLP030-V5VQG289 | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP030-V5VQG289ES | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP030-V5VQG289I | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP030-V5VQG289PP | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
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