參數(shù)資料
型號： AGLP060V2CSG201I
元件分類： FPGA
英文描述： FPGA, 1584 CLBS, 60000 GATES, PBGA201
封裝： 14 X 14 MM, 1.2 MM HEIGHT, 0.8 MM PITCH, ROHS COMPLIANT, CSP-201
文件頁數(shù)： 42/128頁
文件大?。?/td> 4383K
代理商： AGLP060V2CSG201I
IGLOO PLUS DC and Switching Characteristics
2- 6
R ev isio n 1 1
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = ΔT + TA
EQ 1
where:
TA = Ambient temperature
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
ja * P
θ
ja = Junction-to-ambient of the package. θja numbers are located in Figure 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
θ
jc and the junction-to-ambient air thermal resistivity is
θ
ja. The thermal characteristics for θja are shown for two air flow rates. The maximum operating junction
temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
–
θ
ja(°C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
°C70°C
–
20.5°C/W
-------------------------------------
1.46 W
=
Table 2-5 Package Thermal Resistivities
Package Type
Pin
Count
θ
jc
θ
ja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
201
TBD
C/W
281
TBD
C/W
289
TBD
C/W
Very Thin Quad Flat Package (VQFP)
128
TBD
C/W
176
TBD
C/W
Table 2-6 Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC =1.425 V)
For IGLOO PLUS V2 or V5 devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.425
0.934
0.953
0.971
1.000
1.007
1.013
1.5
0.855
0.874
0.891
0.917
0.924
0.929
1.575
0.799
0.816
0.832
0.857
0.864
0.868
相關(guān)PDF資料
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AGLP060V2CSG201 FPGA, 1584 CLBS, 60000 GATES, PBGA201
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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AGLP060-V2CSG289 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP060V2-CSG289 功能描述:IC FPGA IGLOO PLUS 60K 289-CSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOO PLUS 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
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AGLP060-V2CSG289I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
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