參數(shù)資料
型號: AGLP060V5-VQG176
元件分類: FPGA
英文描述: FPGA, 1584 CLBS, 60000 GATES, PQFP176
封裝: 20 X 20 MM, 1 MM HEIGHT, 0.4 MM PITCH, VQFP-176
文件頁數(shù): 34/128頁
文件大小: 4383K
代理商: AGLP060V5-VQG176
IGLOO PLUS Low Power Flash FPGAs
Re vi s i on 11
1-7
I/Os with Advanced I/O Standards
The IGLOO PLUS family of FPGAs features a flexible I/O structure, supporting a range of voltages (1.2
V, 1.5 V, 1.8 V, 2.5 V, 3.0 V wide range, and 3.3 V). IGLOO PLUS FPGAs support many different I/O
standards.
The I/Os are organized into four banks. All devices in IGLOO PLUS have four banks. The configuration
of these banks determines the I/O standards supported.
Each I/O module contains several input, output, and output enable registers.
Hot-swap (also called hot-plug, or hot-insertion) is the operation of hot-insertion or hot-removal of a card
in a powered-up system.
Cold-sparing (also called cold-swap) refers to the ability of a device to leave system data undisturbed
when the system is powered up, while the component itself is powered down, or when power supplies
are floating.
Wide Range I/O Support
Actel IGLOO PLUS devices support JEDEC-defined wide range I/O operation. IGLOO PLUS devices
support both the JESD8-B specification, covering 3 V and 3.3 V supplies, for an effective operating range
of 2.7 V to 3.6 V, and JESD8-12 with its 1.2 V nominal, supporting an effective operating range of 1.14 V
to 1.575 V.
Wider I/O range means designers can eliminate power supplies or power conditioning components from
the board or move to less costly components with greater tolerances. Wide range eases I/O bank
management and provides enhanced protection from system voltage spikes, while providing the flexibility
to easily run custom voltage applications.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLP060V5-VQG176I 功能描述:IC FPGA IGLOO PLUS 60K 176-VQFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO PLUS 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
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