參數(shù)資料
型號: AGLP125V5CS289
元件分類: FPGA
英文描述: FPGA, 3120 CLBS, 125000 GATES, PBGA289
封裝: 14 X 14 MM , 1.2 MM HEIGHT, 0.8 MM PITCH, CSP-289
文件頁數(shù): 94/128頁
文件大?。?/td> 4383K
代理商: AGLP125V5CS289
IGLOO PLUS DC and Switching Characteristics
2- 54
R e v i sio n 1 1
VersaTile Specifications as a Sequential Module
The IGLOO PLUS library offers a wide variety of sequential cells, including flip-flops and latches. Each
has a data input and optional enable, clear, or preset. In this section, timing characteristics are presented
for a representative sample from the library. For more details, refer to the Fusion, IGLOO/e, and
Figure 2-19 Sample of Sequential Cells
DQ
DFN1
Data
CLK
Out
D
Q
DFN1C1
Data
CLK
Out
CLR
DQ
DFI1E1P1
Data
CLK
Out
En
PRE
D
Q
DFN1E1
Data
CLK
Out
En
相關(guān)PDF資料
PDF描述
AGLP125V5CSG281I FPGA, 3120 CLBS, 125000 GATES, PBGA281
AGLP125V5CSG281 FPGA, 3120 CLBS, 125000 GATES, PBGA281
AGLP125V5CSG289I FPGA, 3120 CLBS, 125000 GATES, PBGA289
AGLP125V5CSG289 FPGA, 3120 CLBS, 125000 GATES, PBGA289
AGLP060V2-CS201I FPGA, 1584 CLBS, 60000 GATES, PBGA201
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLP125-V5CS289 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125V5-CS289 功能描述:IC FPGA IGLOO PLUS 125K 289-CSP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO PLUS 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLP125-V5CS289ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125-V5CS289I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125V5-CS289I 功能描述:IC FPGA IGLOO PLUS 125K 289-CSP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO PLUS 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)