參數(shù)資料
型號: AM29F010-70FE
廠商: ADVANCED MICRO DEVICES INC
元件分類: PROM
英文描述: LM118/LM218/LM318 Operational Amplifiers; Package: TO-99; No of Pins: 8; Qty per Container: 500; Container: Box
中文描述: 128K X 8 FLASH 5V PROM, 70 ns, PDSO32
封裝: REVERSE, TSOP-32
文件頁數(shù): 7/8頁
文件大?。?/td> 56K
代理商: AM29F010-70FE
1/13/98
Am29F010 Known Good Die
7
S U P P L E M E N T
PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . 174 mils x 189 mils
4.42 mm x 4.80 mm
Die Thickness . . . . . . . . . . . . . ~20 mils or ~0.51 mm
Bond Pad Size . . . . . . . . . . . . . . 4.47 mils x 4.47 mils
113.48
μ
m x 113.48
μ
m
Pad Area Free of Passivation . . . . . . . . . .19.98 mils
2
12,878
μ
m
2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Bond Pad Metalization. . . . . . . . . . . . . . . . . . Al/Si/Cu
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
V
CC
(Supply Voltage). . . . . . . . . . . . . . .4.5 V to 5.5 V
Junction Temperature Under Bias . .T
J
(max) = 130
°
C
For Read-only . . . . . . . . . . .T
J
(max) = 140
°
C
Operating Temperature . . . Commercial 0
°
C to +70
°
C
Industrial –40
°
C to +85
°
C
Extended –55
°
C to +125
°
C
MANUFACTURING INFORMATION
Manufacturing and Test. . . . . . . . . Fab 14, Austin, TX
Manufacturing ID. . . . . . . . . . . . . . . . . . . . . .98108AK
Preparation for Shipment . . . . . . . .Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . CS19AFDS
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250
°
C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30
°
C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
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