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參數(shù)資料
| 型號： | AM29F100B-120DTC1 |
| 廠商： | ADVANCED MICRO DEVICES INC |
| 元件分類： | PROM |
| 英文描述： | 1 Megabit (128 K x 8-Bit/64 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1 |
| 中文描述： | 128K X 8 FLASH 5V PROM, 120 ns, UUC47 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 57K |
| 代理商： | AM29F100B-120DTC1 |
Am29F100 Known Good Die
7
SU PP L E ME NT
PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . 266 mils x 142 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . 6.76 mm x 3.61 mm
Die Thickness . . . . . . . . . . . . . ~20 mils or ~0.51 mm
Bond Pad Size . . . . . . . . . . . . . . 4.64 mils x 4.64 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . 117.8
m x 117.8 m
Pad Area Free of Passivation . . . . . . . . . .21.53 mils2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13,877
m2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Si/Cu
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V
Junction Temperature Under Bias . .TJ (max) = 130°C
Operating Temperature
. . . . . . . . . . . . . . . . . . . . . . Commercial 0
°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55
°C to +125°C
MANUFACTURING INFORMATION
Manufacturing and Test. . . . . . . . . Fab 14, Austin, TX
Manufacturing ID (Top Boot) . . . . . . . . . . . . 98242AK
(Bottom Boot) . . . . . . . .98242ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . CS19AFDS
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250
°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30
°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
相關PDF資料 |
PDF描述 |
|---|---|
| Am29F100B-120DTE | 1 Megabit (128 K x 8-Bit/64 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1 |
| Am29F100B-120DTI | 1 Megabit (128 K x 8-Bit/64 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1 |
| AM29F100B-120DWE1 | 1 Megabit (128 K x 8-Bit/64 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1 |
| Am29F100B-120DWI | Hex Inverters With Open-Drain Outputs 14-SOIC -40 to 85 |
| AM29F100B-120EC | Hex Inverters With Open-Drain Outputs 14-SSOP -40 to 85 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AM29F100B120EC | 制造商:AMD 功能描述:* |
| AM29F100B-120EC | 制造商:Advanced Micro Devices 功能描述: |
| AM29F100B120SC | 制造商:AMD 功能描述:New |
| AM29F100B-120SC | 制造商:Advanced Micro Devices 功能描述:NOR Flash, 64K x 16, 44 Pin, Plastic, SOP |
| AM29F100B90SIT | 制造商:AMD 功能描述:New |
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