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參數(shù)資料
| 型號(hào)： | AM29F100B-90SE |
| 廠商： | ADVANCED MICRO DEVICES INC |
| 元件分類： | PROM |
| 英文描述： | Hex Buffers/Drivers With Open-Drain Outputs 14-TSSOP -40 to 85 |
| 中文描述： | 128K X 8 FLASH 5V PROM, 90 ns, PDSO44 |
| 封裝： | SOP-44 |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大小： | 57K |
| 代理商： | AM29F100B-90SE |
Am29F100 Known Good Die
7
SU PP L E ME NT
PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . 266 mils x 142 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . 6.76 mm x 3.61 mm
Die Thickness . . . . . . . . . . . . . ~20 mils or ~0.51 mm
Bond Pad Size . . . . . . . . . . . . . . 4.64 mils x 4.64 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . 117.8
m x 117.8 m
Pad Area Free of Passivation . . . . . . . . . .21.53 mils2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13,877
m2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Si/Cu
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V
Junction Temperature Under Bias . .TJ (max) = 130°C
Operating Temperature
. . . . . . . . . . . . . . . . . . . . . . Commercial 0
°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55
°C to +125°C
MANUFACTURING INFORMATION
Manufacturing and Test. . . . . . . . . Fab 14, Austin, TX
Manufacturing ID (Top Boot) . . . . . . . . . . . . 98242AK
(Bottom Boot) . . . . . . . .98242ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . CS19AFDS
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250
°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30
°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
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PDF描述 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM29F100B90SIT | 制造商:AMD 功能描述:New |
| AM29F100T-120EC | 制造商:Advanced Micro Devices 功能描述:NOR Flash, 64K x 16, 48 Pin, Plastic, TSSOP |
| AM29F100T120SI | 制造商:AMD 功能描述:NEW |
| AM29F100T-70EC | 制造商:Advanced Micro Devices 功能描述: |
| AM29F160DB-120EC | 制造商:Spansion 功能描述:16M (2MX8/1MX16) 5V, BOOT BLOCK, BOT, TSOP48, COM - Trays |
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