參數(shù)資料
型號: AM29LV200BB-70DFC
廠商: ADVANCED MICRO DEVICES INC
元件分類: PROM
英文描述: 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
中文描述: 128K X 16 FLASH 3V PROM, 70 ns, UUC43
封裝: DIE-43
文件頁數(shù): 7/11頁
文件大?。?/td> 200K
代理商: AM29LV200BB-70DFC
November 18, 2003
Am29LV200B Known Good Die
7
S U P P L E M E N T
PACKAGING INFORMATION
Surftape Packaging
Gel-Pak and Waffle Pack Packaging
Direction of Feed
Orientation relative to
leading edge of tape
and reel
1
AMD logo location
Orientation relative to
top left corner of
Gel-Pak
and Waffle Pack
cavity plate
AMD logo location
相關(guān)PDF資料
PDF描述
AM29LV200BB-70DFI 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB-70DPC 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB-70DPI 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB-70DRC 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB-70DRI 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
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