參數(shù)資料
型號(hào): AM29LV200BB35DFC1
廠商: Advanced Micro Devices, Inc.
英文描述: 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
中文描述: 2兆位(256畝x 8-Bit/128畝x 16位),3.0伏的CMOS只,引導(dǎo)扇區(qū)快閃記憶體,修編模具1
文件頁數(shù): 7/11頁
文件大?。?/td> 200K
代理商: AM29LV200BB35DFC1
November 18, 2003
Am29LV200B Known Good Die
7
S U P P L E M E N T
PACKAGING INFORMATION
Surftape Packaging
Gel-Pak and Waffle Pack Packaging
Direction of Feed
Orientation relative to
leading edge of tape
and reel
1
AMD logo location
Orientation relative to
top left corner of
Gel-Pak
and Waffle Pack
cavity plate
AMD logo location
相關(guān)PDF資料
PDF描述
AM29LV200BB35DFE1 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB35DFI1 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB35DPC1 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB35DPE1 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB35DPI1 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
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