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參數(shù)資料
| 型號： | AM29LV200BB35DFE1 |
| 廠商： | Advanced Micro Devices, Inc. |
| 英文描述： | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
| 中文描述： | 2兆位（256畝x 8-Bit/128畝x 16位），3.0伏的CMOS只，引導扇區(qū)快閃記憶體，修編模具1 |
| 文件頁數(shù)： | 6/11頁 |
| 文件大小： | 200K |
| 代理商： | AM29LV200BB35DFE1 |
6
Am29LV200B Known Good Die
November 18, 2003
S U P P L E M E N T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
Am29LV200B
T
-
60
DP
C
1
DIE REVISION
This number refers to the specific AMD manufacturing process and
product technology reflected in this document. It is entered in the
revision field of AMD standard product nomenclature.
TEMPERATURE RANGE
C
=
Commercial (0°C to +70°C)
I
=
Industrial (–40
°
C to +85
°
C)
E
=
Extended (–55
°
C to +125
°
C)
PACKAGE TYPE AND
MINIMUM ORDER QUANTITY
DP
=
Waffle Pack, 500 μm thick die
245 die per 5 tray stack
DT
=
Surftape (Tape and Reel), 500 μm thick die
2500 per 7-inch reel
DW
=
Gel-Pak Wafer Tray (sawn wafer on frame)
500 μm thick die
Call AMD sales office for minimum order quantity
DR
=
Surftape (Tape and Reel), 280 μm thick die
2500 per 7-inch reel
DF
=
Waffle Pack, 280 μm thick die
245 die per 5 tray stack
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
=
Top sector
B
=
Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29LV200B Known Good Die
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS Flash Memory
3.0 Volt-only Program and Erase
Valid Combinations
AM29LV200BT-60R
AM29LV200BB-60R
DRC, DRI, DFC, DFI
DPC, DPI, DTC,
DTI, DWC, DWI
AM29LV200BT-70,
AM29LV200BB-70
AM29LV200BT-90,
AM29LV200BB-90
AM29LV200BT-120,
AM29LV200BB-120
AM29LV200BT-70R
AM29LV200BB-70R
DFE, DRE, DPE, DTE
相關PDF資料 |
PDF描述 |
|---|---|
| AM29LV200BB35DFI1 | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
| AM29LV200BB35DPC1 | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
| AM29LV200BB35DPE1 | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
| AM29LV200BB35DPI1 | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
| AM29LV200BB35DRC1 | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AM29LV200BB-90EC | 制造商:Advanced Micro Devices 功能描述:NOR Flash, 128K x 16, 48 Pin, Plastic, TSSOP |
| AM29LV200BB-90FC | 制造商:Advanced Micro Devices 功能描述:2 Mb (128K x 16) Boot Sector, Flash Memory |
| AM29LV256MH120RPGI | 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 256MBIT 32MX8/16MX16 120NS 64BGA - Trays |
| AM29LV256MH123RPGI | 制造商:Advanced Micro Devices 功能描述: |
| AM29LV256MH94REI | 制造商:Spansion 功能描述:256M (32MX8/16MX16) 3V REG, MIRRORBIT, TSOP56, IND - Trays |
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