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參數(shù)資料
| 型號(hào)： | AM29LV200BT50DWC1 |
| 廠商： | Advanced Micro Devices, Inc. |
| 英文描述： | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
| 中文描述： | 2兆位（256畝x 8-Bit/128畝x 16位），3.0伏的CMOS只，引導(dǎo)扇區(qū)快閃記憶體，修編模具1 |
| 文件頁數(shù)： | 7/11頁 |
| 文件大?。?/td> | 200K |
| 代理商： | AM29LV200BT50DWC1 |
November 18, 2003
Am29LV200B Known Good Die
7
S U P P L E M E N T
PACKAGING INFORMATION
Surftape Packaging
Gel-Pak and Waffle Pack Packaging
Direction of Feed
Orientation relative to
leading edge of tape
and reel
1
AMD logo location
Orientation relative to
top left corner of
Gel-Pak
and Waffle Pack
cavity plate
AMD logo location
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM29LV200BT50DWI1 | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
| AM29LV200BT-60RDFC | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
| AM29LV200BT-60RDFI | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
| AM29LV200BT-60RDPC | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
| AM29LV200BT-60RDPI | 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 |
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