December 14, 2005
Am29LV320D
3
D A T A S H E E T
TABLE OF CONTENTS
Continuity of Specifications .......................................................i
For More Information .................................................................i
Distinctive Characteristics . . . . . . . . . . . . . . . . . . 1
ARCHITECTURAL ADVANTAGES ...................................... 1
PERFORMANCE CHARACTERISTICS ............................... 1
SOFTWARE FEATURES ..................................................... 1
HARDWARE FEATURES .................................................... 1
General Description . . . . . . . . . . . . . . . . . . . . . . . 2
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6
Special Package Handling Instructions ....................................7
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10
Table 1. Am29LV320D Device Bus Operations ..............................10
Word/Byte Configuration ........................................................11
Requirements for Reading Array Data ...................................11
Writing Commands/Command Sequences ............................11
Accelerated Program Operation ..........................................11
Autoselect Functions ...........................................................11
Standby Mode ........................................................................12
Automatic Sleep Mode ...........................................................12
RESET#: Hardware Reset Pin ...............................................12
Output Disable Mode ..............................................................12
Table 2. Top Boot Sector Addresses(Am29LV320DT) ..................13
Table 3. Top Boot Secured Silicon Sector Addresses................... 14
Table 4. Bottom Boot Sector Addresses(Am29LV320DB) .............14
Table 5. Bottom Boot Secured Silicon Sector Addresses.............. 15
Autoselect Mode .....................................................................16
Table 6. Autoselect Codes (HighVoltageMethod) ........................16
Sector/Sector Block Protection and Unprotection ..................17
Table 7. Top Boot Sector/Sector Block Addresses
forProtection/Unprotection .............................................................17
Table 8. Bottom Boot Sector/Sector Block
AddressesforProtection/Unprotection ...........................................17
Write Protect (WP#) ................................................................18
Temporary Sector Unprotect ..................................................18
Figure 1. Temporary Sector Unprotect Operation........................... 18
Figure 2. In-System Sector Protect/UnprotectAlgorithms.............. 19
Secured Silicon Sector Flash Memory Region .......................20
Factory Locked: Secured Silicon Sector Programmed
andProtectedattheFactory ...............................................20
Customer Lockable: Secured Silicon Sector NOT Programmed
orProtectedattheFactory ..................................................20
Figure 3. Secured Silicon Sector Protect Verify.............................. 21
Hardware Data Protection ......................................................21
Low VCC Write Inhibit .........................................................21
Write Pulse “Glitch” Protection ............................................21
Logical Inhibit ......................................................................21
Power-Up Write Inhibit .........................................................21
Common Flash Memory Interface (CFI) . . . . . . .21
Table 9. CFI Query Identification String.......................................... 22
Table 10. System Interface String................................................... 22
Table 11. Device Geometry Definition............................................ 23
Table 12. Primary Vendor-Specific Extended Query...................... 24
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25
Reading Array Data ................................................................25
Autoselect Command Sequence ............................................25
Table 13. Autoselect Codes ...........................................................25
Enter Secured Silicon Sector/Exit Secured Silicon Sector
CommandSequence ..............................................................25
Byte/Word Program Command Sequence .............................26
Unlock Bypass Command Sequence ..................................26
Figure 4. Program Operation......................................................... 27
Chip Erase Command Sequence ...........................................27
Sector Erase Command Sequence ........................................27
Erase Suspend/Erase Resume Commands ...........................28
Figure 5. Erase Operation.............................................................. 28
Command Definitions .............................................................29
Table 14. Am29LV320D Command Definitions .............................29
Write Operation Status . . . . . . . . . . . . . . . . . . . . 30
DQ7: Data# Polling .................................................................30
Figure 6. Data# Polling Algorithm.................................................. 30
RY/BY#: Ready/Busy# ............................................................31
DQ6: Toggle Bit I ....................................................................31
Figure 7. Toggle Bit Algorithm........................................................ 31
DQ2: Toggle Bit II ...................................................................31
Reading Toggle Bits DQ6/DQ2 ...............................................32
DQ5: Exceeded Timing Limits ................................................32
DQ3: Sector Erase Timer .......................................................32
Table 15. Write Operation Status ...................................................33
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
Figure 8. Maximum Negative OvershootWaveform...................... 34
Figure 9. Maximum Positive OvershootWaveform........................ 34
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
CMOS Compatible ..................................................................35
Zero-Power Flash .................................................................36
Figure 10. I
CC1
Current vs. Time (Showing Active and
AutomaticSleepCurrents)............................................................. 36
Figure 11. Typical I
vs. Frequency............................................ 36
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 12. Test Setup.................................................................... 37
Table 16. Test Specifications .........................................................37
Figure 13. Input Waveforms and Measurement Levels................. 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Read-Only Operations ...........................................................38
Figure 14. Read Operation Timings............................................... 38
Hardware Reset (RESET#) ....................................................39
Figure 15. Reset Timings............................................................... 39
Word/Byte Configuration (BYTE#) .............................................40
Figure 16. BYTE# Timings for Read Operations............................ 40
Figure 17. BYTE# Timings for Write Operations............................ 40
Erase and Program Operations .................................................41
Figure 18. Program Operation Timings.......................................... 42
Figure 19. Chip/Sector Erase Operation Timings.......................... 43
Figure 20. Data# Polling Timings (DuringEmbeddedAlgorithms). 44
Figure 21. Toggle Bit Timings (DuringEmbeddedAlgorithms)...... 45
Figure 22. DQ2 vs. DQ6................................................................. 45
Temporary Sector Unprotect .....................................................46
Figure 23. Temporary Sector Unprotect TimingDiagram.............. 46
Figure 24. Accelerated Program Timing Diagram.......................... 46
Figure 25. Sector/Sector Block Protect and
UnprotectTimingDiagram............................................................. 47
Alternate CE# Controlled Erase and ProgramOperations ........48
Figure 26. Alternate CE# Controlled Write