參數(shù)資料
型號： Am29LV320DT90ED
廠商： Advanced Micro Devices, Inc.
英文描述： 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory
中文描述： 32兆位（4個M × 8位/ 2米x 16位），3.0伏的CMOS只，引導(dǎo)扇區(qū)閃存
文件頁數(shù)： 5/55頁
文件大?。?/td> 1258K
代理商： AM29LV320DT90ED
November 15, 2004
Am29LV320D
5
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .7
Special Package Handling Instructions ....................................8
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Ordering Information . . . . . . . . . . . . . . . . . . . . . .10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . .11
Table 1. Am29LV320D Device Bus Operations ..............................11
Word/Byte Configuration ........................................................11
Requirements for Reading Array Data ...................................11
Writing Commands/Command Sequences ............................12
Accelerated ProgramOperation ..........................................12
Autoselect Functions ...........................................................12
Standby Mode ........................................................................12
Automatic Sleep Mode ...........................................................13
RESET#: Hardware Reset Pin ...............................................13
Output Disable Mode ..............................................................13
Table 2. Top Boot Sector Addresses (Am29LV320DT) ..................13
Table 3. Top Boot SecSi
TM
Sector Addresses................................ 14
Table 4. BottomBoot Sector Addresses (Am29LV320DB) .............15
Table 5. BottomBoot SecSi
TM
Sector Addresses.......................... 16
Autoselect Mode .....................................................................16
Table 6. Autoselect Codes (HighVoltageMethod) ........................16
Sector/Sector Block Protection and Unprotection ..................17
Table 7. Top Boot Sector/Sector Block Addresses
forProtection/Unprotection .............................................................17
Table 8. BottomBoot Sector/Sector Block
Addresses forProtection/Unprotection ...........................................17
Write Protect (WP#) ................................................................18
Temporary Sector Unprotect ..................................................18
Figure 1. Temporary Sector Unprotect Operation........................... 18
Figure 2. In-SystemSector Protect/UnprotectAlgorithms.............. 19
SecSi
TM
Sector (Secured Silicon) Flash Memory Region .......20
Factory Locked: SecSi Sector Programmed
andProtectedattheFactory ...............................................20
Customer Lockable: SecSi Sector NOT Programmed
orProtectedattheFactory ..................................................20
Figure 3. SecSi Sector Protect Verify.............................................. 21
Hardware Data Protection ......................................................21
Low VCC Write Inhibit .........................................................21
Write Pulse “Glitch” Protection ............................................21
Logical Inhibit ......................................................................21
Power-Up Write Inhibit .........................................................21
Common Flash Memory Interface (CFI) . . . . . . .21
Table 9. CFI Query Identification String.......................................... 22
Table 10. SystemInterface String................................................... 22
Table 11. Device Geometry Definition............................................ 23
Table 12. Primary Vendor-Specific Extended Query...................... 24
Command Definitions . . . . . . . . . . . . . . . . . . . . . .25
Reading Array Data ................................................................25
Reset Command .....................................................................25
Autoselect Command Sequence ............................................25
Table 13. Autoselect Codes ............................................................25
Enter SecSi
TM
Sector/Exit SecSi Sector
CommandSequence ..............................................................26
Byte/Word ProgramCommand Sequence .............................26
Unlock Bypass Command Sequence ..................................26
Figure 4. ProgramOperation......................................................... 27
Chip Erase Command Sequence ...........................................27
Sector Erase Command Sequence ........................................27
Erase Suspend/Erase Resume Commands ...........................28
Figure 5. Erase Operation.............................................................. 28
Command Definitions .............................................................29
Table 14. Am29LV320D Command Definitions .............................29
Write Operation Status . . . . . . . . . . . . . . . . . . . . 30
DQ7: Data#Polling .................................................................30
Figure 6. Data#Polling Algorithm.................................................. 30
RY/BY#: Ready/Busy#............................................................31
DQ6: Toggle Bit I ....................................................................31
Figure 7. Toggle Bit Algorithm........................................................ 31
DQ2: Toggle Bit II ...................................................................32
Reading Toggle Bits DQ6/DQ2 ...............................................32
DQ5: Exceeded Timng Limts ................................................32
DQ3: Sector Erase Timer .......................................................32
Table 15. Write Operation Status ...................................................33
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
Figure 8. MaximumNegative OvershootWaveform...................... 34
Figure 9. MaximumPositive OvershootWaveform........................ 34
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 10. I
CC1
Current vs. Time (Showing Active and
AutomaticSleepCurrents)............................................................. 36
Figure 11. Typical I
CC1
vs. Frequency............................................ 36
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 12. Test Setup.................................................................... 37
Table 16. Test Specifications .........................................................37
Figure 13. Input Waveforms and Measurement Levels................. 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 14. Read Operation Timngs............................................... 38
Figure 15. Reset Timngs............................................................... 39
Word/Byte Configuration (BYTE#) .............................................40
Figure 16. BYTE#Timngs for Read Operations............................ 40
Figure 17. BYTE#Timngs for Write Operations............................ 40
Erase and ProgramOperations .................................................41
Figure 18. ProgramOperation Timngs.......................................... 42
Figure 19. Chip/Sector Erase Operation Timngs.......................... 43
Figure 20. Data# Polling Timngs (DuringEmbeddedAlgorithms). 44
Figure 21. Toggle Bit Timngs (DuringEmbeddedAlgorithms)...... 45
Figure 22. DQ2 vs. DQ6................................................................. 45
Temporary Sector Unprotect .....................................................46
Figure 23. Temporary Sector Unprotect TimngDiagram.............. 46
Figure 24. Accelerated ProgramTimng Diagram.......................... 46
Figure 25. Sector/Sector Block Protect and
UnprotectTimngDiagram............................................................. 47
Alternate CE#Controlled Erase and ProgramOperations ........48
Figure 26. Alternate CE#Controlled Write
(Erase/Program OperationTimngs.............................................. 49
Erase And Programming Performance . . . . . . . 50
Latchup Characteristics . . . . . . . . . . . . . . . . . . . 50
TSOP and BGA Package Capacitance . . . . . . . . 50
Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 51
FBD048—48-ball Fine-Pitch Ball Grid Array (FBGA)
6x12mmpackage ...................................................................51
TS 048—48-Pin Standard TSOP ...............................................52
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53
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