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Am29LV320MT/B
May 16, 2003
D A T A S H E E T
TABLE OF CONTENTS
Product Selector Guide. . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10
Table 1. Device Bus Operations .....................................................10
Requirements for Reading Array Data ...................................10
Writing Commands/Command Sequences ............................11
Automatic Sleep Mode ...........................................................12
RESET#: Hardware Reset Pin ...............................................12
Output Disable Mode ..............................................................12
Table 2. Am29LV320MT Top Boot Sector Architecture ..................12
Table 3. Am29LV320MB BottomBoot Sector Architecture .............14
Table 4. Autoselect Codes, (High Voltage Method) .......................16
Sector Group Protection and Unprotection .............................17
Table 5. Am29LV320MT Top Boot SectorProtection .....................17
Table 6. Am29LV320MB BottomBoot SectorProtection ................17
Write Protect (WP#) ................................................................17
Temporary Sector Group Unprotect .......................................18
Figure 1. Temporary Sector Group UnprotectOperation................ 18
Figure 2. In-SystemSector Group Protect/UnprotectAlgorithms... 19
SecSi (Secured Silicon) Sector Flash MemoryRegion ..........20
Table 7. SecSi Sector Contents ......................................................20
Figure 3. SecSi Sector Protect Verify.............................................. 21
Hardware Data Protection ......................................................21
Common Flash Memory Interface (CFI). . . . . . . 21
Command Definitions . . . . . . . . . . . . . . . . . . . . . 24
Reading Array Data ................................................................24
Reset Command .....................................................................25
Autoselect Command Sequence ............................................25
Enter SecSi Sector/Exit SecSi Sector CommandSequence ..25
Word/Byte ProgramCommand Sequence .............................25
Figure 4. Write Buffer Programmng Operation............................... 28
Figure 5. ProgramOperation.......................................................... 29
ProgramSuspend/ProgramResume Command Sequence ...29
Figure 6. ProgramSuspend/ProgramResume............................... 30
Chip Erase Command Sequence ...........................................30
Sector Erase Command Sequence ........................................30
Figure 7. Erase Operation............................................................... 31
Erase Suspend/Erase Resume Commands ...........................31
Write Operation Status . . . . . . . . . . . . . . . . . . . . 34
DQ7: Data# Polling .................................................................34
Figure 8. Data#Polling Algorithm................................................... 34
DQ6: Toggle Bit I ....................................................................35
Figure 9. Toggle Bit Algorithm........................................................ 36
DQ2: Toggle Bit II ...................................................................36
Reading Toggle Bits DQ6/DQ2 ..............................................36
DQ5: Exceeded Timng Limts ................................................37
DQ3: Sector Erase Timer .......................................................37
DQ1: Write-to-Buffer Abort .....................................................37
Table 14. Write Operation Status ...................................................37
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 38
Figure 10. MaximumNegative OvershootWaveform................... 38
Figure 11. MaximumPositive OvershootWaveform..................... 38
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 12. Test Setup.................................................................... 40
Table 15. Test Specifications .........................................................40
Key to Switching Waveforms. . . . . . . . . . . . . . . . 40
Figure 13. Input Waveforms and
Measurement Levels...................................................................... 40
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 41
Read-Only Operations ...........................................................41
Figure 14. Read Operation Timngs............................................... 41
Figure 15. Page Read Timngs...................................................... 42
Hardware Reset (RESET#) ....................................................43
Figure 16. Reset Timngs............................................................... 43
Erase and ProgramOperations ..............................................44
Figure 17. ProgramOperation Timngs.......................................... 45
Figure 18. Accelerated ProgramTimng Diagram.......................... 45
Figure 19. Chip/Sector Erase Operation Timngs.......................... 46
Figure 20. Data# Polling Timngs (During Embedded Algorithms). 47
Figure 21. Toggle Bit Timngs (During Embedded Algorithms)...... 48
Figure 22. DQ2 vs. DQ6................................................................. 48
Temporary Sector Unprotect ..................................................49
Figure 23. Temporary Sector Group Unprotect TimngDiagram... 49
Figure 24. Sector Group Protect and Unprotect TimngDiagram.. 50
Alternate CE#Controlled Erase and ProgramOperations .....51
Figure 25. Alternate CE#Controlled Write (Erase/Program)
OperationTimngs.......................................................................... 52
Erase And Programming Performance. . . . . . . . 53
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 53
TSOP Pin and BGA Package Capacitance . . . . . 54
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 55
TS 048—48-Pin Standard Pinout Thin Small Outline Package
(TSOP) ...................................................................................55
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 56
TS 048—48-Pin Standard Pinout Thin Small Outline Package
(TSOP) ...................................................................................56
FBC048—48-Ball Fine-pitch Ball Grid Array (fBGA)
9x8mmPackage ..................................................................57
Physical Dimensions
LAA064—64-Ball Fortified Ball Grid Array (FBGA)
13 x 11 mm Package. . . . . . . . . . . . . . . . . . . . . . . 58
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 60