參數(shù)資料
型號： Am29PDS322D
廠商： Advanced Micro Devices, Inc.
英文描述： High Speed CMOS Logic 8-Bit Universal Shift Register with 3-State Outputs 20-CDIP -55 to 125
中文描述： 32兆位（2米× 16位），1.8伏的CMOS只（1.8伏至2.2 V）同步讀/寫頁模式引導(dǎo)扇區(qū)閃存
文件頁數(shù)： 4/50頁
文件大?。?/td> 839K
代理商： AM29PDS322D
August 7, 2002
Am29PDS322D
3
A D V A N C E I N F O R M A T I O N
TABLE OF CONTENTS
Product Selector Guide. . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Special Handling Instructions for FBGA Package ....................5
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . 7
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 8
Table 1. Am29PDS322D Device Bus Operations .............................8
Requirements for Reading Array Data .....................................8
Read Mode ...............................................................................8
RandomRead (Non-Page Mode Read) ............................................8
Page Mode Read ......................................................................9
Table 2. Page Word Mode ................................................................9
Writing Commands/Command Sequences ..............................9
Accelerated ProgramOperation ........................................................9
Autoselect Functions .........................................................................9
Simultaneous Read/Write Operations with Zero Latency .........9
Standby Mode.......................................................................... 9
Automatic Sleep Mode ...........................................................10
RESET#: Hardware Reset Pin ...............................................10
Output Disable Mode ..............................................................10
Table 3. Am29PDS322DT Top Boot Sector Addresses ..................11
Table 4. Am29PDS322DT Top Boot SecSi Sector Address ...........12
Table 5. Am29PDS322DB BottomBoot Sector Addresses ............12
Table 6. Am29PDS322DB BottomBoot SecSi Sector Address . . .14
Autoselect Mode..................................................................... 15
Table 7. Autoselect Codes (High Voltage Method) ........................15
Sector/Sector Block Protection and Unprotection.................. 16
Table 8. Top Boot Sector/Sector Block Addresses for
Protection/Unprotection ...................................................................16
Table 9. BottomBoot Sector/Sector Block Addresses for
Protection/Unprotection ...................................................................16
Write Protect (WP#) ................................................................17
Temporary Sector/Sector Block Unprotect .............................17
Figure 1. Temporary Sector Unprotect Operation........................... 17
Figure 2. Temporary Sector Group Unprotect Operation................ 18
Figure 3. In-SystemSector Group Protect/Unprotect Algorithms... 19
SecSi (Secured Silicon) Sector Flash Memory Region ..........20
Factory Locked: SecSi Sector Programmed and Protected
attheFactory ..................................................................................20
Hardware Data Protection ......................................................20
Low V
CC
Write Inhibit .......................................................................20
Write Pulse “Glitch” Protection ........................................................21
Logical Inhibit ..................................................................................21
Power-Up Write Inhibit ....................................................................21
Command Definitions . . . . . . . . . . . . . . . . . . . . . 21
Reading Array Data ................................................................21
Reset Command .....................................................................21
Autoselect Command Sequence ............................................21
Enter SecSi Sector/Exit SecSi Sector Command Sequence ..22
Word ProgramCommand Sequence .....................................22
Unlock Bypass Command Sequence ..............................................22
Chip Erase Command Sequence ...........................................22
Figure 4. Unlock Bypass Algorithm................................................. 23
Figure 5. ProgramOperation.......................................................... 23
Sector Erase Command Sequence ........................................24
Erase Suspend/Erase Resume Commands ...........................24
Figure 6. Erase Operation.............................................................. 25
Am29PDS322D Command Definitions . . . . . . . . 26
Write Operation Status. . . . . . . . . . . . . . . . . . . . . 27
DQ7: Data#Polling .................................................................27
Figure 7. Data#Polling Algorithm.................................................. 27
RY/BY#: Ready/Busy#............................................................ 28
DQ6: Toggle Bit I ....................................................................28
Figure 8. Toggle Bit Algorithm........................................................ 28
DQ2: Toggle Bit II ...................................................................29
Reading Toggle Bits DQ6/DQ2 ...............................................29
DQ5: Exceeded Timng Limts ................................................29
DQ3: Sector Erase Timer .......................................................29
Table 11. Write Operation Status ...................................................30
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 31
Figure 9. MaximumNegative OvershootWaveform...................... 31
Figure 10. MaximumPositive OvershootWaveform...................... 31
Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 31
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 11. I
CC1
Current vs. Time (Showing Active and Automatic
SleepCurrents).............................................................................. 33
Figure 12. Typical I
CC1
vs. Frequency............................................ 33
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 13. Test Setup.................................................................... 34
Table 12. Test Specifications .........................................................34
Key to Switching Waveforms. . . . . . . . . . . . . . . . 34
Figure 14. Input Waveforms and Measurement Levels................. 34
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 15. Conventional Read Operation Timngs......................... 35
Figure 16. Page Mode Read Timngs............................................ 36
Hardware Reset (RESET#) ....................................................37
Figure 17. Reset Timngs............................................................... 37
Erase and ProgramOperations ..............................................38
Figure 18. ProgramOperation Timngs.......................................... 39
Figure 19. Accelerated ProgramTimng Diagram.......................... 39
Figure 20. Chip/Sector Erase Operation Timngs.......................... 40
Figure 21. Back-to-back Read/Write Cycle Timngs...................... 41
Figure 22. Data# Polling Timngs (During Embedded Algorithms). 41
Figure 23. Toggle Bit Timngs (During Embedded Algorithms)...... 42
Figure 24. DQ2 vs. DQ6................................................................. 42
Temporary Sector Unprotect ..................................................43
Figure 25. Temporary Sector Group Unprotect Timng Diagram... 43
Figure 26. Sector Group Protect and Unprotect Timng Diagram.. 44
Alternate CE#Controlled Erase and ProgramOperations .....45
Figure 27. Alternate CE#Controlled Write (Erase/Program)
OperationTimngs.......................................................................... 46
Erase And Programming Performance. . . . . . . . 47
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 47
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 48
FBD048
—
48-Ball Fine-Pitch Ball Grid Array (FBGA)
12x6mmpackage ................................................................48
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 49
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