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參數(shù)資料
| 型號： | AM29SL400CT100RWAI |
| 廠商： | SPANSION LLC |
| 元件分類： | DRAM |
| 英文描述： | 4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS 1.8 Volt-only Super Low Voltage Flash Memory |
| 中文描述： | 256K X 16 FLASH 1.8V PROM, 100 ns, PBGA48 |
| 封裝： | 6 X 8 MM, 0.80 MM PITCH, FBGA-48 |
| 文件頁數(shù)： | 40/44頁 |
| 文件大?。?/td> | 945K |
| 代理商： | AM29SL400CT100RWAI |
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38
March 3, 2005
A d v a n c e I n f o r m a t i o n
Erase and Programming Performance
Notes:
1.
typicals assume checkerboard pattern.
2.
Under worst case conditions of 90°C, V
CC
= 1.8 V, 1,000,000 cycles.
3.
The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum program times listed.
4.
In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5.
System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See
Table 5 on page 18
for further information on command definitions.
6.
The device has a minimum guaranteed erase and program cycle endurance of 1,000,000 cycles.
Latchup Characteristics
Typical program and erase times assume the following conditions: 25
°
C, 2.0 V V
CC
, 1,000,000 cycles. Additionally, programming
Includes all pins except V
CC
. Test conditions: V
CC
= 1.8 V, one pin at a time.
TSOP Pin and BGA Package Capacitance
Notes:
1.
Sampled, not 100% tested.
2.
Test conditions T
A
= 25°C, f = 1.0 MHz.
Data Retention
Parameter
Typ (Note
1)
Max (Note 2)
Unit
Comments
Sector Erase Time
2
15
s
Excludes 00h programming
prior to erasure (Note 4)
Chip Erase Time
38
s
Byte Programming Time
10
300
μs
Excludes system level
overhead (Note 5)
Word Programming Time
12
360
μs
Chip Programming Time
(Note 3)
Byte Mode
5
40
s
Word Mode
3.5
30
s
Description
Min
Max
Input voltage with respect to V
SS
on all pins except I/O pins
(including A9, OE#, and RESET#)
–1.0 V
11.0 V
Input voltage with respect to V
SS
on all I/O pins
–0.5 V
V
CC
+ 0.5 V
V
CC
Current
–100 mA
+100 mA
Parameter Symbol
Parameter Description
Test Setup
Typ
Max
Unit
C
IN
Input Capacitance
V
IN
= 0
TSOP
6
7.5
pF
Fine-pitch BGA
4.2
5.0
pF
C
OUT
Output Capacitance
V
OUT
= 0
TSOP
8.5
12
pF
Fine-pitch BGA
5.4
6.5
pF
C
IN2
Control Pin Capacitance
V
IN
= 0
TSOP
7.5
9
pF
Fine-pitch BGA
3.9
4.7
pF
Parameter
Test Conditions
Min
Unit
Minimum Pattern Data Retention Time
150
°
C
10
Years
125
°
C
20
Years
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