參數(shù)資料
型號(hào)： AMD-K5-PR133ABR
元件分類： 32位微控制器
英文描述： 32-Bit Microprocessor
中文描述： 32位微處理器
文件頁(yè)數(shù)： 31/44頁(yè)
文件大小： 2886K
代理商： AMD-K5-PR133ABR
Thermal Measurement Procedure
23
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
interface material (ADUX White Pad by Thermagon, Inc.). The
third material was thermally conductive elastomer (AS-210
Rose Pad by Thermagon, Inc.).
The steady state test results are detailed in Tables 7 through
16. Each table is accompanied by a figure that represents the
test results graphically. Thermal grease is clearly the best ther-
mal interface material. The variation in thermal interface
resistance was caused by the heat sink flatness. Having a heat
sink improved thermal resistance over not having a heat sink.
Heat sinks B and C show similar performance. Heat sink B has
a greater area in contact with the processor case, but heat sink
C is taller. The volume of heat sink B is 3.7 cubic inches and
the volume of heat sink C is 3.8 cubic inches.
Table 6. Table of Thermal Measurements
Parameter
Symbol
Units
Junction to Air
θ
ja
θ
ja
@ 200 linear feet/min (lfpm)
θ
ja
@ 400 lfpm
θ
jc
θ
ca
θ
sa
θ
cs
o
C / Watt
Junction to Airflow
o
C / Watt
Junction to Airflow
o
C / Watt
Junction to Case
o
C / Watt
Case to Ambient
o
C / Watt
Heat Sink to Ambient
o
C / Watt
Case to Heat Sink
o
C / Watt
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