參數(shù)資料
型號(hào): AMD-K5-PR166ABX
元件分類(lèi): 32位微控制器
英文描述: 32-Bit Microprocessor
中文描述: 32位微處理器
文件頁(yè)數(shù): 14/44頁(yè)
文件大小: 2886K
代理商: AMD-K5-PR166ABX
6
AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
(e.g., 0.25 in, 0.5 in, 0.75 in, 1.00 in, 1.25 in, etc.) to handle dif-
ferent processor speed grades. The speed of an AMD-K5 pro-
cessor is directly proportional to its power consumption (see
The AMD-K5 Processor Thermal and Power Specifications
on page
17 for more information). Larger heat sinks usually cost more
and can have reduced internal airflow. Airflow is a function of
the friction coefficient, channel size, surface conditions, and
heat sink shape. Closely examine the geometry of the heat sink
to determine the best heat sink orientation for reducing air-
flow resistance.
Heat sink thermal performance is expressed for both natural
and forced airflow. A typical heat sink performance curve (see
Figure 2) is shown with two curves. Natural convection is rep-
resented by the positive slope curve. This curve is read from
the left axis (heat sink temperature) and bottom axis (heat dis-
sipation). Forced convection is represented by the negative
slope curve. This curve is read from the upper axis (air veloc-
ity) and the right axis (thermal resistance from sink to ambi-
ent). Airflow is often the biggest uncertainty for processor
designs and it is the most important variable on heat sink ther-
mal performance.
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