參數(shù)資料
型號: AMD-K6-2E
英文描述: AMD-K6-2E - AMD-K6-2E Embedded Processor Data Sheet
中文描述: 的AMD - K6 - 2E號-的AMD - K6 - 2E號嵌入式處理器數(shù)據(jù)手冊
文件頁數(shù): 27/44頁
文件大?。?/td> 2886K
代理商: AMD-K6-2E
Physical Dimensions of the AMD-K5 Processor
19
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
Both the ceramic and the ceramic thermal slug PGA packages
have the same overall dimensions (see Figure 7A and Figure
7B). Thus, the same cooling solution can be used for both pro-
cessor packages. The heat sink clip that mechanically attaches
the heat sink and processor to the processor ZIF socket is not
affected by the package. The thermal interface layer (i.e., the
silicon grease) has a cross sectional area of 3.8 square inches
(1.95 inch squared) for the ceramic package, and 1.56 square
inches (1.25 inch squared) for the ceramic thermal slug pack-
age. The copper slug has greater thermal conductivity than
the ceramic package, allowing the processor junction to oper-
ate at a lower temperature for the same power levels. Vibra-
tion and shock testing have shown that the same heat sink clips
perform equally for both processor packages.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AMD-K6-2E/233AFR 制造商:Advanced Micro Devices 功能描述:MPU K6 -2E RISC 64-Bit 0.25um 233MHz 3.3V 321-Pin CPGA
AMD-K6-2E/233AFZ 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:AMD-K6⑩-2E Embedded Processor
AMD-K6-2E/233AMR 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:AMD-K6⑩-2E Embedded Processor
AMD-K6-2E/233AMZ 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:AMD-K6⑩-2E Embedded Processor
AMD-K6-2E/266AFR 制造商:Advanced Micro Devices 功能描述:MPU AMD-K6-2E RISC 64-Bit 0.25um 266MHz 3.3V 321-Pin CPGA