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| 型號(hào)： | AMD-K6-III-P |
| 英文描述： | Mobile AMD-K6?-III-P Processor Data Sheet |
| 中文描述： | 移動(dòng)的AMD - K6？三磷處理器數(shù)據(jù)手冊(cè) |
| 文件頁(yè)數(shù)： | 18/44頁(yè) |
| 文件大?。?/td> | 2886K |
| 代理商： | AMD-K6-III-P |
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10
AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
fan operating life. See
Heat Sink Fan Motor Manufacturer
on
page 35 for more information.
The heat sink/fan module uses an attached fan that generates
airflow into the heat sink. This is referred to as
impingement
airflow.
(see Figure 4 for more information.)
Figure 4. Heat Sink Impingement Airflow
Heat Sink Mechanical Interface
The heat sink mechanical interface (e.g., heat sink clips) is
designed to withstand shock and vibration during shipping and
normal operation. These heat sink clips assert pressure against
the thermal interface and secure the heat sink to one of the fol-
lowing: the AMD-K5 processor, the AMD-K5 processor socket,
or the personal computer motherboard. Different options for
securing mechanical interfaces to the AMD-K5 processor are
shown in Figure 5 and Figure 6. In both figures, options 3 and 4
are recommended. The first two options are not recommended
because the processor can be dislodged from its socket due to
shock and vibration.
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