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參數(shù)資料
| 型號： | AMD-K7500MTR51BC |
| 元件分類： | 微處理器 |
| 英文描述： | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| 中文描述： | 微處理器| 32位|的CMOS |卡|塑料 |
| 文件頁數(shù)： | 14/44頁 |
| 文件大?。?/td> | 2886K |
| 代理商： | AMD-K7500MTR51BC |
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6
AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
(e.g., 0.25 in, 0.5 in, 0.75 in, 1.00 in, 1.25 in, etc.) to handle dif-
ferent processor speed grades. The speed of an AMD-K5 pro-
cessor is directly proportional to its power consumption (see
The AMD-K5 Processor Thermal and Power Specifications
on page
17 for more information). Larger heat sinks usually cost more
and can have reduced internal airflow. Airflow is a function of
the friction coefficient, channel size, surface conditions, and
heat sink shape. Closely examine the geometry of the heat sink
to determine the best heat sink orientation for reducing air-
flow resistance.
Heat sink thermal performance is expressed for both natural
and forced airflow. A typical heat sink performance curve (see
Figure 2) is shown with two curves. Natural convection is rep-
resented by the positive slope curve. This curve is read from
the left axis (heat sink temperature) and bottom axis (heat dis-
sipation). Forced convection is represented by the negative
slope curve. This curve is read from the upper axis (air veloc-
ity) and the right axis (thermal resistance from sink to ambi-
ent). Airflow is often the biggest uncertainty for processor
designs and it is the most important variable on heat sink ther-
mal performance.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMD-K7550MTR51BA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7550MTR51BC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7600MTR51BA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7600MTR51BC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7650MTR51BA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
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