參數(shù)資料
型號: AMD-K7600MTR51BC
元件分類: 微處理器
英文描述: MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC
中文描述: 微處理器| 32位|的CMOS |卡|塑料
文件頁數(shù): 9/44頁
文件大?。?/td> 2886K
代理商: AMD-K7600MTR51BC
Introduction
1
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
AMD-K5 Processor
Thermal Considerations
Introduction
All semiconductor devices dissipate heat as a byproduct of nor-
mal operation. Prior to fourth-generation processors, these
devices were able to dissipate heat via the integrated circuit
package in most personal computer applications. Fifth-genera-
tion processors use sub-micron, CMOS VLSI integrated circuit
technology to support superscalar processor architecture like
the AMD-K5 processor, which has integrated more than
3 million transistors on a single semiconductor die. Fifth-gener-
ation processors generally operate at a reduced supply voltage
to minimize power consumption. Reducing V
cc
from +5 V to
+3.3 V decreases the power consumption by approximately 43
percent. Even with this power savings, fifth-generation proces-
sors can still exceed the maximum case temperature specifica-
tion when operating at maximum clock frequency. External
integrated cooling solutions such as heat sinks, heat spreaders,
and heat sink/fan modules are required to maintain safe ther-
mal margins for the processor junction temperature.
This application note discusses integrated circuit cooling solu-
tions, thermal terms, and explains the thermal equations. This
information allows designers to select the best processor cool-
ing solution for personal computer applications. These solu-
tions should have the following attributes: maintain safe
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