參數(shù)資料
型號(hào)： AMD-K7700MTR51BA
元件分類： 微處理器
英文描述： MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC
中文描述： 微處理器| 32位|的CMOS |卡|塑料
文件頁(yè)數(shù)： 24/44頁(yè)
文件大小： 2886K
代理商： AMD-K7700MTR51BA
16
AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
When using thermal conductive adhesive tape it is important
to select one tape that fills the gap between the two surfaces
(tolerance of both processor case top and heat sink is worst
case of 0.003 inch). Therefore, tape thickness of a minimum of
0.006 inch should be used to fill the microscopic holes in the
surfaces.
When ceramic packages are used, some manufacturers recom-
mend using a primer (e.g., 1088 Primer by Chomerics) on the
ceramic package before the adhesive tape is applied. The
primer fills the porous ceramic surface to allow the adhesive
tape to obtain a greater bond surface.
The procedure for applying thermal tape to the AMD-K5 pro-
cessor and the heat sink is:
1. Cut the tape to a size that can cover the entire area between
the AMD-K5 processor and the heat sink.
2. Make sure that all oils and dust are removed from the
AMD-K5 processor case top and the bottom of the heat sink
to ensure maximum adhesion. This is done by using a lint-
free cloth with an industrial cleaner (e.g., toluene, acetone,
or isopropyl alcohol) and rubbing both surfaces.
3. Peel away the clear release liner from the non-embossed
side of the thermal adhesive tape.
4. Apply tape to the AMD-K5 processor case top.
5. Smooth over the entire surface of the tape with moderate
pressure, using the applicator provided.
6. Remove the blue liner from the embossed side of the tape.
7. Align both the AMD-K5 processor and the heat sink and
apply pressure (e.g., 10 psi).
Note:
Improved surface contact can be achieved by heating the
tape with a conventional heat gun, not to exceed 100
o
C,
prior to applying pressure.
8. Approximately 70% of the ultimate adhesion is achieved at
initial contact. At least 36 hours is required before ultimate
adhesive strength is achieved.
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