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參數(shù)資料
| 型號： | AMMC-5023 |
| 英文描述： | 23 GHz Low Noise Amplifier (21.2?26.5 GHz) |
| 中文描述： | 23 GHz的低噪聲放大器（21.2？26.5千兆赫） |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 212K |
| 代理商： | AMMC-5023 |
7
Biasing and Operation
The AMMC-5023 has four
cascaded gain stages as shown in
Figure 19. The first two gain
stages at the input are biased with
the V
D1
drain supply. Similarly,
the two output stages are biased
with the V
D2
supply. Standard
LNA operation is with a single
positive DC drain supply voltage
(V
D1
=V
D2
=5 V) as shown in the
assembly diagram, Figure 2(a).
If desired, the output stage DC
supply voltage (V
D2
) can be
increased to improve output
power capability while maintain-
ing optimum low noise bias
conditions for the input section.
The output power may also be
adjusted by applying a positive
voltage at V
G2
to alter the operat-
ing bias point for both the output
FETs. Increasing the voltage
applied to V
G2
(more positively)
results in a more negative gate-
to-source voltage and, therefore,
lower drain current. Figures
20(b) and 20(c) illustrate how the
device can be assembled for
independent drain supply
operation and for output stage
gate bias control.
Assembly Techniques
The chip should be attached
directly to the ground plane
using either a fluxless AuSn
solder preform or electrically
conductive epoxy
[1]
. For conduc-
tive epoxy, the amount should be
just enough to provide a thin
fillet around the bottom perim-
eter of the die. The ground plane
should be free of any residue that
may jeopardize electrical or
mechanical attachment. Caution
should be taken to not exceed the
Absolute Maximum Rating for
assembly temperature and time.
Thermosonic wedge bonding is
the preferred method for wire
attachment to the bond pads. The
RF connections should be kept as
short as possible to minimize
inductance. Gold mesh
[2]
or
double-bonding with 0.7 mil gold
wire is recommended.
Mesh can be attached using a
2 mil round tracking tool and a
tool force of approximately
22 grams with an ultrasonic
Figure 19. AMMC-5023 Schematic.
power of roughly 55 dB for a
duration of 76
±
8 mS. A guided
wedge at an ultrasonic power
level of 64 dB can be used for the
0.7 mil wire. The recommended
wire bond stage temperature is
150
±
2
°
C.
The chip is 100 mm thick and
should be handled with care.
This MMIC has exposed air
bridges on the top surface.
Handle at edges or with a custom
collet (do not pick up die with
vacuum on die center.)
This MMIC is also static sensitive
and ESD handling precautions
should be taken.
For more information, see
Agilent Application Note 54
“GaAs MMIC ESD, Die Attach
and Bonding Guidelines.”
Notes:
1. Ablebond 84-1 LM1 silver
epoxy is recommended.
2. Buckbee-Mears Corporation,
St. Paul, MN, 800-262-3824.
RF Input
RF Output
V
G1
V
D1
V
G2
V
D2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMC-5023-W10 | 功能描述:射頻放大器 Amplifier GaAs MMIC LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-5023-W50 | 功能描述:射頻放大器 Amplifier GaAs MMIC LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-5024 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:30 KHz-40GHz Traveling Wave Amplifier |
| AMMC-5024-W10 | 功能描述:射頻放大器 Amplifier GaAs MMIC TWA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-5024-W50 | 功能描述:射頻放大器 Amplifier GaAs MMIC TWA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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