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參數(shù)資料
| 型號： | AMMP-5618-BLK |
| 英文描述： | 6-20 GHz General Purpose Amplifier |
| 中文描述： | 6-20 GHz的通用放大器 |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 252K |
| 代理商： | AMMP-5618-BLK |
7
Recommended SMT Attachment
The AMMP Packaged Devices are
compatible with high volume
surface mount PCB assembly
processes.
The PCB material and mounting
pattern, as defined in the data
sheet, optimizes RF performance
and is strongly recommended.
An electronic drawing of the land
pattern is available upon request
from Agilent Sales & Application
Engineering.
Manual Assembly
1. Follow ESD precautions while
handling packages.
2. Handling should be along the
edges with tweezers.
3. Recommended attachment is
conductive solder paste.
Please see recommended
solder reflow profile. Conduc-
tive epoxy is
not
recom-
mended. Hand soldering is
not
recommended.
4. Apply solder paste using a
stencil printer or dot place-
ment. The volume of solder
paste will be dependent on
PCB and component layout
and should be controlled to
ensure consistent mechanical
and electrical performance.
5. Follow solder paste and
vendor’s recommendations
when developing a solder
reflow profile. A standard
profile will have a steady ramp
up from room temperature to
the pre-heat temperature to
avoid damage due to thermal
shock.
6. Packages have been qualified
to withstand a peak tempera-
ture of 260
°
C for 20 seconds.
Verify that the profile will not
expose device beyond these
limits.
Dimensional Tolerances: 0.002" [0.05 mm]
1
2
3
7
.200 [5.08]
6
5
3
2 1
5
6
7
.200 [5.08]
8
4
.075 [1.91]
.114 [2.9]
.014 [0.365]
.016 [0.40]
.012 [0.30]
.028 [0.70]
.093 [2.36]
.016 [0.40]
.100 [2.54]
.011 [0.28]
.018 [0.46]
.126 [3.2]
.059 [1.5]
.100 [2.54]
.029 [0.75]
4
8
Front View
Side View
Back View
Notes:
1. * Indicates Pin 1
2. Dimensions are in inches [millimeters]
3. All Grounds must be soldered to PCB RF Ground
.093 [2.36]
.010 [0.25]
.011 [0.28]
.126 [3.20]
.059 [1.50] .020 [0.50]
.018 [0.46]
.018 [0.46]
.114 [2.90]
.0095 [0.24]
.012 [0.3]
.016 [0.40]
.0095 [0.24]
.016 [0.40]
Figure 23. Suggested PCB Material and Land Pattern.
Figure 22. Outline Drawing.
相關PDF資料 |
PDF描述 |
|---|---|
| AMMP-5618-TR1 | 6-20 GHz General Purpose Amplifier |
| AMMP-5618-TR2 | 6-20 GHz General Purpose Amplifier |
| AMMP-5618 | 6-20 GHz General Purpose Amplifier |
| AMMP-6530 | 5?30 GHz Image Reject Mixer |
| AMMP-6530-BLK | 5?30 GHz Image Reject Mixer |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-5618-TR1 | 功能描述:射頻放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-5618-TR2 | 功能描述:射頻放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-5620 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:6 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620_13 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:6 a?? 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620-BLKG | 功能描述:射頻放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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