參數(shù)資料
型號: AMMP-5620-TR2G
元件分類: 放大器
英文描述: 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝: 5 X 5 MM, 1.25 MM HEIGHT, SMT, 8 PIN
文件頁數(shù): 3/12頁
文件大?。?/td> 522K
代理商: AMMP-5620-TR2G
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 26. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127 mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The combined PCB and stencil layout is shown in Figure
27.
Figure 26. Stencil Outline Drawing (mm)
Figure 27. Combined PCB and Stencil Layout
Figure 25. Suggested PCB Land Pattern and Stencil Layout
相關(guān)PDF資料
PDF描述
AMMP-6222-TR2G 7000 MHz - 21000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6222-TR1G 7000 MHz - 21000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6408-TR2G 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6408-TR1G 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6408-BLKG 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
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