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參數(shù)資料
| 型號： | AMMP-6120-TR1 |
| 元件分類： | 倍頻器 |
| 英文描述： | 8000 MHz - 24000 MHz RF/MICROWAVE FREQUENCY DOUBLER |
| 封裝： | 5 X 5 MM, SMT, 8 PIN |
| 文件頁數(shù)： | 8/9頁 |
| 文件大?。?/td> | 353K |
| 代理商： | AMMP-6120-TR1 |
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Seconds
Temp
(°C)
Ramp 1
Preheat
Ramp 2
Reflow
Cooling
Peak = 250°C
Melting point = 218°C
Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder paste.
Please see recommended solder reow prole. Conduc-
tive epoxy is
not recommended. Hand soldering is not
recommended.
4. Apply solder paste using a stencil printer or dot place-
ment. The volume of solder paste will be dependent on
PCB and component layout and should be controlled
to ensure consistent mechanical and electrical perfor-
mance.
5. Follow solder paste and vendor’s recommendations
when developing a solder reow prole. A standard
prole will have a steady ramp up from room tempera-
ture to the pre-heat temperature to avoid damage due
to thermal shock.
6. Packages have been qualied to withstand a peak tem-
perature of 260
qC for 20 seconds. Verify that the prole
will not expose device beyond these limits.
Solder Reow Prole
The most commonly used solder reow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reow prole for automated reow
processes is shown in Figure 23. This prole is designed
to ensure reliable nished joints. However, the prole
indicated in Figure 1 will vary among dierent solder
pastes from dierent manufacturers and is shown here for
reference only.
Recommended solder reow prole
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 24. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly aect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127 mm (5 mils) thick stainless steel which
is capable of producing the required ne stencil outline.
The combined PCB and stencil layout is shown in below.
Figure 23. Suggested lead-free reow prole for SnAgCu solder paste.
Figure 24. Stencil outline drawing (mm).
Figure 25. Combined PCB and stencil layouts (mm).
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0.38
0.56
0.1
0.3
0.39
0.55
0.15
2.79
1.47
0.25
0.77
0.52
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6120-TR2 | 功能描述:射頻無線雜項(xiàng) Doubler MMIC 6-20GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| AMMP-6125-BLKG | 功能描述:射頻放大器 6-13 GHzFreq Mult RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6125-TR1G | 功能描述:射頻放大器 6-13 GHzFreq Mult RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6125-TR2G | 功能描述:射頻放大器 6-13 GHzFreq Mult RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6130 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:30 GHz Power Amplifier with Frequency Multiplier (x2) |
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