參數(shù)資料
型號(hào)： AMMP-6408-TR2G
元件分類： 放大器
英文描述： 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝： 5 X 5 MM, SMT, 8 PIN
文件頁(yè)數(shù)： 3/12頁(yè)
文件大?。?/td> 605K
代理商： AMMP-6408-TR2G
Figure 22. Suggested lead-free reflow profile for SnAgCu solder paste
Ordering Information
AMMP-6408 Part Number Ordering Information
Part Number
Devices per
Container
AMMP-6408-BLKG
0
Antistaticbag
AMMP-6408-TRG
00
7”Reel
AMMP-6408-TR2G
500
7”Reel
Manual Assembly
FollowESDprecautionswhilehandlingpackages.
Handlingshouldbealongtheedgeswithtweezers.
Recommended attachment is conductive solder
paste.Pleaseseerecommendedsolderreflowprofile.
NeitherConductiveepoxyorhandsolderingisrecom-
mended.
Apply solder paste using a stencil printer or dot
placement.Thevolumeofsolderpastewillbedepen-
dent on PCB and component layout and should be
controlledtoensureconsistentmechanicalandelec-
tricalperformance.
Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A stan-
dard profile will have a steady ramp up from room
temperaturetothepre-heattemp.toavoiddamage
duetothermalshock.
Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds.Verify that the
profilewillnotexposedevicebeyondtheselimits.
Aproperlydesignedsolderscreenorstencilisrequired
toensureoptimumamountofsolderpasteisdeposited
onto the PCB pads. The recommended stencil layout
is shown in Figure 2. The stencil has a solder paste
deposition opening approximately 70% to 90% of the
PCB pad. Reducing stencil opening can potentially
generate more voids underneath. On the other
hand, stencil openings larger than 00% will lead to
excessivesolderpastesmearorbridgingacrosstheI/O
pads. Considering the fact that solder paste thickness
will directly affect the quality of the solder joint, a
good choice is to use a laser cut stencil composed of
0.27mm(5mils)thickstainlesssteelwhichiscapable
ofproducingtherequiredfinestenciloutline.
The most commonly used solder reflow method is
accomplished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 22. This profile is
designedtoensurereliablefinishedjoints.However,the
profile indicated in Figure will vary among different
solderpastesfromdifferentmanufacturersandisshown
hereforreferenceonly.
TIME (SECONDS)
300
250
200
150
100
50
0
50
100
150
200
250
300
0
TE
M
PE
R
AT
U
R
E
(
C
)
PEAK = 250 ± 5 C
MELTING POINT = 218 C
RAMP 1
RAMP 2
REFLOW
COOLING
PREHEAT
Package Dimensions
3
2
1
4
8
BACK VIEW
0.012 (0.30)
0.016 (0.40)
0.014 (0.365)
0.011 (0.28)
0.018 (0.46)
0.114 (2.90)
0.100 (2.54)
0.059
(1.5)
0.126
(3.2)
0.029 (0.75)
5
6
7
0.016 (0.40)
0.93 (2.36)
0.028 (0.70)
SYMBOL
A
B
DIMENSIONS ARE IN INCHES (MM)
MIN.
0.198 (5.03)
0.0685 (1.74)
MAX.
0.213 (5.4)
0.088 (2.25)
DIMENSIONAL TOLERANCE: 0.002" (0.05 mm)
1
2
3
7
6
5
4
8
B
A
AMMP
XXXX
YWWDNN
FRONT VIEW
SIDE VIEW
*
相關(guān)PDF資料
PDF描述
AMMP-6408-TR1G 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6408-BLKG 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6425 18000 MHz - 28000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6441-BLKG 36000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6441-TR1G 36000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
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AMMP-6420-BLK 制造商:Avago Technologies 功能描述:RF Amp Module Single Power Amp 18GHz 7V 8-Pin SMD Bag
AMMP-6420-TR1 制造商:Avago Technologies 功能描述:RF Amp Module Single Power Amp 18GHz 7V 8-Pin SMD T/R
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