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參數(shù)資料
| 型號(hào)： | AMMP-6425 |
| 元件分類： | 放大器 |
| 英文描述： | 18000 MHz - 28000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 5 X 5 MM, ROHS COMPLIANT, SMT, 8 PIN |
| 文件頁數(shù)： | 11/11頁 |
| 文件大小： | 905K |
| 代理商： | AMMP-6425 |
9
Manual Assembly
Follow ESD precautions while handling packages.
Handling should be along the edges with tweezers.
Recommended attachment is conductive solder
paste. Please see recommended solder reflow profile.
Neither Conductive epoxy or hand soldering is
recommended.
Apply solder paste using a stencil printer or dot
placement.
The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Temp
(°C)
Peak = 250 ± 5°C
Ramp 1
Preheat
Ramp 2
Reflow
Cooling
Melting point = 218°C
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Temp
(°
C)
Peak = 250 ± 5C
Ramp 1
Preheat Ramp 2 Reow
Cooling
Melting point = 218C
Figure 16. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
AMMP-6425 Part Number Ordering Information
Part Number
Devices Per
Container
AMMP-6425-BLKG
10
Antistatic bag
AMMP-6425-TR1G
100
7”Reel
AMMP-6425-TR2G
500
7”Reel
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 15b. The stencil has a solder paste depo-
sition opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 16. This profile is
designed to ensure reliable finished joints. However, the
profile indicated in Figure 1 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMMP-6441-BLKG | 36000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6441-TR1G | 36000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6441-TR2G | 36000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6522-TR2 | 700 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6522-BLK | 700 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6425_13 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:18-28 GHz 1W Power Amplifier in SMT Package |
| AMMP-6425-BLK | 制造商:Avago Technologies 功能描述:17.7-27GHZ 1W POWER AMP, MMIC - Bulk |
| AMMP-6425-BLKG | 功能描述:射頻放大器 18-28 GHz Power Amp RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6425-TR1 | 制造商:Avago Technologies 功能描述: |
| AMMP-6425-TR1G | 功能描述:射頻放大器 18-28 GHz Power Amp RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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