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參數(shù)資料
| 型號(hào)： | AMMP-6530-TR1 |
| 英文描述： | 5?30 GHz Image Reject Mixer |
| 中文描述： | 5？30千兆赫?qǐng)D像抑制混頻器 |
| 文件頁(yè)數(shù)： | 9/10頁(yè) |
| 文件大?。?/td> | 266K |
| 代理商： | AMMP-6530-TR1 |
9
Solder Reflow Profile
The most commonly used solder
reflow method is accomplished in
a belt furnace using convection
heat transfer. The suggested
reflow profile for automated
reflow processes is shown in
Figure 25. This profile is designed
to ensure reliable finished joints.
However, the profile indicated in
Figure 25 will vary among
different solder pastes from
different manufacturers and is
shown here for reference only.
Stencil Design Guidelines
A properly designed solder
screen or stencil is required to
ensure optimum amount of
solder paste is deposited onto
the PCB pads. The recommended
stencil layout is shown in Figure
26. The stencil has a solder paste
deposition opening approxi-
mately 70% to 90% of the PCB
pad. Reducing stencil opening
can potentially generate more
voids underneath. On the other
hand, stencil openings larger
than 100% will lead to excessive
solder paste smear or bridging
across the I/O pads. Considering
the fact that solder paste thick-
ness will directly affect the
quality of the solder joint, a good
choice is to use a laser cut stencil
composed of 0.127 mm (5 mils)
thick stainless steel which is
capable of producing the re-
quired fine stencil outline. The
combined PCB and stencil layout
is shown in Figure 27.
Figure 25. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste.
Figure 26. Stencil Outline Drawing (mm).
Figure 27. Combined PCB and Stencil Layouts (mm).
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
T
°
C
Ramp 1
Preheat
Ramp 2
Reflow
Cooling
Peak = 250
±
5
°
C
Melting point = 218
°
C
0.3
0.4
0.7
0.2
0.3
4x - R0.14
0.9
0.3
0.6
1.6
0.95
1.8
3.20 1.80 0.40
0.36
2.90
1.60
Stencil
Opening
0.30
0.27
0.40
0.36
0.46
0.40
0.60
0.67
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6530-TR2 | 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6532-BLKG | 功能描述:射頻無(wú)線雜項(xiàng) LNA IR Mixer 20-33GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| AMMP-6532-TR1G | 功能描述:射頻無(wú)線雜項(xiàng) LNA IR Mixer 20-33GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| AMMP-6532-TR2G | 功能描述:射頻無(wú)線雜項(xiàng) LNA IR Mixer 20-33GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| AMMP-6545-BLKG | 功能描述:射頻混合器 SubHarmonic Mixer 18-45GHz MMIC RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
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