參數(shù)資料
型號(hào)： AMMP-6530
英文描述： 5?30 GHz Image Reject Mixer
中文描述： 5？30千兆赫?qǐng)D像抑制混頻器
文件頁數(shù)： 8/10頁
文件大?。?/td> 266K
代理商： AMMP-6530
8
Recommended SMT Attachment
The AMMP Packaged Devices are
compatible with high volume
surface mount PCB assembly
processes.
The PCB material and mounting
pattern, as defined in the data
sheet, optimizes RF performance
and is strongly recommended.
An electronic drawing of the land
pattern is available upon request
from Agilent Sales & Application
Engineering.
Manual Assembly
1. Follow ESD precautions while
handling packages.
2. Handling should be along the
edges with tweezers.
3. Recommended attachment is
conductive solder paste.
Please see recommended
solder reflow profile. Conduc-
tive epoxy is
not
recom-
mended. Hand soldering is
not
recommended.
4. Apply solder paste using a
stencil printer or dot place-
ment. The volume of solder
paste will be dependent on
PCB and component layout
and should be controlled to
ensure consistent mechanical
and electrical performance.
5. Follow solder paste and
vendor’s recommendations
when developing a solder
reflow profile. A standard
profile will have a steady ramp
up from room temperature to
the pre-heat temperature to
avoid damage due to thermal
shock.
6. Packages have been qualified
to withstand a peak tempera-
ture of 260
°
C for 20 seconds.
Verify that the profile will not
expose device beyond these
limits.
Figure 24. Suggested PCB Material and Land Pattern. Dimensions in inches [mm].
Material is Rogers R04350, 0.010" thick.
Figure 23. Outline Drawing.
Dimensional Tolerances: 0.002" [0.05 mm]
1
2
3
7
.200 [5.08]
6
5
3
2 1
5
6
7
.200 [5.08]
8
4
.075 [1.91]
.114 [2.9]
.014 [0.365]
.016 [0.40]
.012 [0.30]
.028 [0.70]
.093 [2.36]
.016 [0.40]
.100 [2.54]
.011 [0.28]
.018 [0.46]
.126 [3.2]
.059 [1.5]
.100 [2.54]
.029 [0.75]
4
8
Front View
Side View
Back View
Notes:
1. * Indicates Pin 1
2. Dimensions are in inches [millimeters]
3. All Grounds must be soldered to PCB RF Ground
.093 [2.36]
.010 [0.25]
.011 [0.28]
.126 [3.20]
.059 [1.50] .020 [0.50]
.018 [0.46]
.018 [0.46]
.114 [2.90]
.0095 [0.24]
.012 [0.3]
Ground vias should
be solder filled.
.016 [0.40]
.0095 [0.24]
.016 [0.40]
相關(guān)PDF資料
PDF描述
AMMP-6530-BLK 5?30 GHz Image Reject Mixer
AMMP-6530-TR1 5?30 GHz Image Reject Mixer
AMMP-6530-TR2 5?30 GHz Image Reject Mixer
AMO-HC1CSE40.0000MR Peripheral IC
AMO-HC1CSE40.0000MT PoE transformer, SMT, RoHS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AMMP-6530-BLK 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
AMMP-6530-TR1 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
AMMP-6530-TR2 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
AMMP-6532-BLKG 功能描述:射頻無線雜項(xiàng) LNA IR Mixer 20-33GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel
AMMP-6532-TR1G 功能描述:射頻無線雜項(xiàng) LNA IR Mixer 20-33GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel
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