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參數(shù)資料
| 型號(hào)： | AMMP-6530 |
| 元件分類： | 混頻器 |
| 英文描述： | 5000 MHz - 30000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 10 dB CONVERSION LOSS-MAX |
| 封裝： | SURFACE MOUNT PACKAGE-8 |
| 文件頁(yè)數(shù)： | 8/9頁(yè) |
| 文件大?。?/td> | 229K |
| 代理商： | AMMP-6530 |
This preliminary data is provided to assist you in the evaluation of product(s) currently under development. Until Agilent Technologies
releases this product for general sales, Agilent Technologies reserves the right to alter prices, specifications, features, capabilities,
functions, release dates, and remove availability of the product(s) at anytime.
Revision Date: 25 June 2004
Revision Number: 6
Package Outline Drawing
TOP VIEW
BOTTOM VIEW
PCB Land Pattern
Material is Rogers RO4350, 0.010” thick.
Recommended SMT Attachment
The AMMC Packaged Devices are compatible with
high volume surface mount PCB assembly
processes.
The PCB material and mounting pattern, as
defined in the data sheet, optimizes RF
performance and is strongly recommended.
For power devices, ground vias should be silver
filled. An electronic drawing of the land pattern
is available via the provided link or upon request
from Agilent Sales & Application Engineering.
Manual Assembly
1.
Follow ESD precautions while handling
packages.
2.
Handling should be along the edges with
tweezers or from topside if using a vacuum
collet.
3.
Recommended attachment is conductive
solder paste. Please see recommended
solder reflow profile. Conductive epoxy is not
recommended. Hand soldering is not
recommended.
4. Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and
should be controlled to ensure consistent
mechanical and electrical performance.
Excessive solder will degrade RF performance.
5.
Follow solder paste and vendor’s
recommendations when developing a solder
reflow profile. A standard profile will have a
steady ramp up from room temperature to the
pre-heat temperature to avoid damage due to
thermal shock.
6.
Packages have been qualified to withstand a
peak temperature of 260°C for 20 seconds.
Verify that the profile will not expose device
beyond these limits.
7.
Clean the module with acetone. Rinse with
alcohol. Allow the module to fully dry before
testing.
0
50
100
150
200
250
300
1
22
45
66
87
108
129
150
171
192
213
235
256
278
299
320
341
363
384
260'C
255'C
217'C
40'C
125'C
120 sec m ax
60 - 150 sec
10 - 20 sec
Recommended solder reflow profile
NOTES:
1.
INIDICATES PIN 1
2.
DIMENSIONS ARE IN INCHES [MILIMETERS]
3. ALL GROUNDS MUST BE SOLDERED TO PCB RF GND
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6530-BLK | 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6530-TR1 | 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6530-TR2 | 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6532-BLKG | 功能描述:射頻無線雜項(xiàng) LNA IR Mixer 20-33GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| AMMP-6532-TR1G | 功能描述:射頻無線雜項(xiàng) LNA IR Mixer 20-33GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
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