參數(shù)資料
型號: AN17850A
廠商: Electronic Theatre Controls, Inc.
英文描述: Silicon Monolithic Bipolar IC
中文描述: 硅單片雙極型IC
文件頁數(shù): 14/17頁
文件大小: 148K
代理商: AN17850A
Product Specifications
AN17850A
Semiconductor Company, Matsushita Electric Industrial Co., Ltd.
FMSC-PSDA-002-01 REV 1
Prepared
Checked
Approved
Eff. Date
Eff. Date
Eff. Date
Eff. Date
Ref No.
Total Page
Page No.
G-6
17
14
Power dissipation and Heat Sink
Definition of terms
P
D
: Power Dissipation
Tj: Junction Temperature
T
C
: Case Temperature
T
A
: Ambient Temperature
θ
JC
: Thermal Resistance of junction to case
θ
CA
: Thermal Resistance of case to ambient, normally through heat sink
FIG1. Simplified Illustration of IC
and Heat Sink attached
HEAT SINK
CASE
DIE
T
A
T
C
T
J
θ
CA
θ
JC
The following two equations represent the relations of these terms.
( Tj - T
C
) /
θ
JC
= P
D
(1)
( T
C
- T
A
) /
θ
CA
= P
D
’ (2)
For reliable and long-term, continuous operation, junction temperature should not
exceed 125
O
C and
θ
JC
for FP-12S package is 2
O
C/W. Substitute these values
in Equation 1. After specify the P
D
, T
C
can be determined.
Assume no heat loss at the casing,i.e. all power is dissipated to the ambient
through heat sink, which is quite true. So P
D
= P
D
’. Since T
C
is also known,
one can determine the following using equation2:
a) The rating of heat sink for specific maximum operating ambient temperature, or
b) The maximum operating ambient temperature for specific heat sink rating.
A more general equation can be used for rough calculation.
( T
J
- T
A
) /
θ
JA
= P
D
(3)
θ
JA
=
θ
CA
+
θ
JC
(4)
In this case,
θ
JA
is total thermal resistance of the heat sink and IC package.
Therefore, for specified power dissipation, either heat sink rating or maximum
operating ambient temperature can be decided if the other is known.
Take note that it’s essential to know P
D
value before hand in order to work out
other quantities. P
D
calculation is as shown.
P
D
= Vcc x Icc - Po_total (5)
Vcc: DC supply voltage
Icc: RMS value of IC current
Po_total: Total output power
(Technical Data)
15-AUG-03
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