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參數(shù)資料
| 型號： | AN221E04-QFPTY |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Dynamically Reconfigurable FPAA With Enhanced I/O |
| 中文描述： | 動態(tài)可重構(gòu)FPAA的具有增強的I / O |
| 文件頁數(shù)： | 17/21頁 |
| 文件大?。?/td> | 448K |
| 代理商： | AN221E04-QFPTY |
AN221E04 Datasheet – Dynamically Reconfigurable FPAA With Enhanced I/O
DS030100-U006a - 17 -
MECHANICAL AND HANDLING
The AN221E04 comes in the industry standard 44 lead QFP package.
Dry pack handling is recommended. The package is qualified to MSL3 (JEDEC Standard, J-STD-020A, Level 3). Once the device is
removed from dry pack, 30°C at 60% humidity for not longer than 168 hours is the maximum recommended exposure prior to solder
reflow. If out of dry pack for longer than this recommended period of time, then the recommended bake out procedure prior to solder
reflow is 24 hours at 125°C.
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