參數(shù)資料
型號(hào): AN231E04-E2-QFNTY
廠商: Electronic Theatre Controls, Inc.
英文描述: Dynamically Reconfigurable dpASP
中文描述: 動(dòng)態(tài)可重構(gòu)dpASP
文件頁數(shù): 20/24頁
文件大小: 445K
代理商: AN231E04-E2-QFNTY
AN231E04 Datasheet – Dynamically Reconfigurable dpASP
DS231000-U001d
- 20 -
MECHANICAL AND HANDLING
The AN231E04 comes in the industry standard 44 lead QFN package.
Dry pack handling is recommended. The package is qualified to MSL3 (JEDEC Standard, J-STD-020A, Level 3). Once the
device is removed from dry pack, 30°C at 60% humidity for not longer than 168 hours is the maximum recommended
exposure prior to solder reflow. If out of dry pack for longer than this recommended period of time, then the recommended
bake out procedure prior to solder reflow is 24 hours at 125°C.
The package is compliant with RoHS and is Lead-free. Lead finish is Matt tin (Sn-Cu).
All dimension are in mm
Symbol
Min
Nom
Max
A
-
-
0.90
A1
0.00
0.01
0.05
A2
-
0.65
0.70
A3
-
0.20
-
D
-
7.00
-
D1
-
6.75
-
D2
5.30
5.50
5.70
b
0.20
0.25
0.32
e
-
0.50
-
f
0.26
0.42
0.60
g
0.2
-
-
Q1
0.0’ (Ang.deg. )
12’
R
0.09
-
-
1
2
3
4
5
6
7
8
9
10
32
33
CS2b
CS1b
SCLK
VREFN
BVSS
CFGFLGb
VREFP
VMR
I4P
BVDD
30
31
28
29
26
27
24
25
11
23
12 13 14 15 16 17
19
20
18
21
22
44
43 42 41 40 39
37
36
38
35
34
I4N
M
S
E
L
S
D
D
R
A
I2P
AVD
O2
I2N
AVSS
O2
O1
O1
I1N
I1P
I3P
I
O
O
I
I
I
I
I
O
I
O
A
AN231E04
M
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