ProASICPLUS Flash Family FPGAs 2- 22 v5.9 Note: Each RAM block contains a mul" />
參數(shù)資料
型號: APA150-FGG144I
廠商: Microsemi SoC
文件頁數(shù): 105/178頁
文件大小: 0K
描述: IC FPGA PROASIC+ 150K 144-FBGA
標準包裝: 160
系列: ProASICPLUS
RAM 位總計: 36864
輸入/輸出數(shù): 100
門數(shù): 150000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 144-LBGA
供應商設(shè)備封裝: 144-FPBGA(13x13)
ProASICPLUS Flash Family FPGAs
2- 22
v5.9
Note: Each RAM block contains a multiplexer (called DMUX) for each output signal, increasing design efficiency. These DMUX cells do not
consume any core logic tiles and connect directly to high-speed routing resources between the RAM blocks. They are used when
RAM blocks are cascaded and are automatically inserted by the software tools.
Figure 2-18 Example SRAM Block Diagrams
Table 2-14 Memory Block SRAM Interface Signals
SRAM Signal
Bits
In/Out
Description
WCLKS
1
In
Write clock used on synchronization on write side
RCLKS
1
In
Read clock used on synchronization on read side
RADDR<0:7>
8
In
Read address
RBLKB
1
In
Read block select (active Low)
RDB
1
In
Read pulse (active Low)
WADDR<0:7>
8
In
Write address
WBLKB
1
In
Write block select (active Low)
DI<0:8>
9
In
Input data bits <0:8>, <8> can be used for parity In
WRB
1
In
Write pulse (active Low)
DO<0:8>
9
Out
Output data bits <0:8>, <8> can be used for parity out
RPE
1
Out
Read parity error (active High)
WPE
1
Out
Write parity error (active High)
PARODD
1
In
Selects odd parity generation/detect when High, even parity when Low
Note: Not all signals shown are used in all modes.
SRAM
(256x9)
DI <0:8>
DO <0:8>
RADDR <0:7>
WADDR <0:7>
WRB
RDB
WBLKB
RBLKB
WCLKS
RCLKS
RPE
PARODD
DI <0:8>
WADDR <0:7>
WRB
WBLKB
PARODD
WPE
SRAM
(256x9)
DI <0:8>
DO <0:8>
WADDR <0:7>
WRB
RDB
WBLKB
RBLKB
WCLKS
RPE
PARODD
WPE
RADDR <0:7>
PARODD
DI <0:8>
DO <0:8>
RADDR <0:7>
WADDR <0:7>
WRB
RDB
WBLKB
RBLKB
RCLKS
RPE
WPE
DO <0:8>
RADDR <0:7>
RDB
RBLKB
RCLKS
RPE
Sync Write
and
Sync Read
Ports
Async Write
and
Async Read
Ports
Sync Write
and
Async Read
Ports
Async Write
and
Sync Read
Ports
SRAM
(256x9)
SRAM
(256x9)
相關(guān)PDF資料
PDF描述
GMC60DRYI-S93 CONN EDGECARD 120PS DIP .100 SLD
APA150-FG144I IC FPGA PROASIC+ 150K 144-FBGA
ACC40DRYN-S734 CONN EDGECARD 80POS DIP .100 SLD
A3P600-FG484I IC FPGA 1KB FLASH 600K 484-FBGA
W972GG6JB-3 IC DDR2 SDRAM 2GBITS 84WBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
APA150-FGG256 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設(shè)備封裝:256-FPBGA(17x17)
APA150-FGG256A 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設(shè)備封裝:256-FPBGA(17x17)
APA150-FGG256I 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設(shè)備封裝:484-FPBGA(27X27)
APA150-FGGB 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA150-FGGES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC Flash Family FPGAs