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參數(shù)資料
| 型號： | APD032 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS |
| 中文描述： | 包裝機械規(guī)格和參數(shù) |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 76K |
| 代理商： | APD032 |
59
UDT Sensors Inc.
Phone: 310-978-0516
Fax: 310-644-1727
http:\\www.udt.com
1. Parameter Definitions:
A
= Distance from top of chip to top of glass.
a
= Photodiode Anode.
B
= Distance from top of glass to bottom of case.
c
= Photodiode Cathode
(Note: cathode is common to case in metal package products unless otherwise noted)
.
W
= Window Diameter.
F.O.V.
= Filed of View (see definition below).
2.
Dimensions are in inches (1 inch = 25.4 mm).
3.
Pin diameters are 0.018 ± 0.001" unless otherwise specified.
4.
Tolerances
(unless otherwise noted)
General:
0.XX
0.XXX ± 0.005"
± 0.01"
Chip Centering:
± 0.010"
Dimension `A':
± 0.015"
5.
Windows
All `UV' Enhanced products are provided with QUARTZ glass windows, 0.027 ± 0.002" thick.
All `XUV' products are provided with removable windows.
All `DLS' PSD products are provided with A/R coated glass windows.
All `FIL'
photoconductive
and
photovoltaic
products are epoxy filled instead of glass windows.
I
NTRODUCTION
A
F.O.V.
W
F.O.V. = tan
-1
[W/2A]
P
ACKAGE
M
ECHANICAL
S
PECIFICATIONS
AND
P
ARAMETERS
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