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參數(shù)資料
| 型號(hào)： | APDS-9120-020 |
| 元件分類： | 速度傳感器和接近開(kāi)關(guān) |
| 英文描述： | PROXIMITY SENSOR-PHOTOELECTRIC, 1.25-2.55V, SQUARE, SURFACE MOUNT |
| 文件頁(yè)數(shù)： | 15/16頁(yè) |
| 文件大小： | 244K |
| 代理商： | APDS-9120-020 |
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8
Process Zone
Symbol
'T
Maximum
'T/'time
or Duration
Heat Up
P1, R1
25°C to 150°C
3°C/s
Solder Paste Dry
P2, R2
150°C to 200°C
100s to 180s
Solder Reow
P3, R3
P3, R4
200°C to 260°C
260°C to 200°C
3°C/s
-6°C/s
Cool Down
P4, R5
200°C to 25°C
-6°C/s
Time maintained above liquidus point, 217°C
> 217°C
60s to 120s
Peak Temperature
260°C
–
Time within 5°C of actual Peak Temperature
–
20s to 40s
Time 25°C to Peak Temperature
25°C to 260°C
8mins
Recommended Reow Prole
50
100
300
150
200
250
t-TIME
(SECONDS)
25
80
120
150
180
200
230
255
0
T-
TEMPERATURE
(°C)
R1
R2
R3
R4
R5
217
MAX 260C
60 sec to 90 sec
Above 217 C
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL DOWN
The reow prole is a straight-line representation of
a nominal temperature prole for a convective reow
solder process. The temperature prole is divided into
four process zones, each with dierent
'T/'time tem-
perature change rates or duration. The
'T/'time rates or
duration are detailed in the above table. The temperatures
are measured at the component to printed circuit board
connections.
In process zone P1, the PC board and component pins are
heated to a temperature of 150°C to activate the ux in the
solder paste. The temperature ramp up rate, R1, is limited
to 3°C per second to allow for even heating of both the PC
board and component pins.
Process zone P2 should be of sucient time duration (100
to 180 seconds) to dry the solder paste. The temperature
is raised to a level just below the liquidus point of the
solder.
Process zone P3 is the solder reow zone. In zone P3, the tem-
perature is quickly raised above the liquidus point of solder
to 260°C (500°F) for optimum results. The dwell time above
the liquidus point of solder should be between 60 and 90
seconds. This is to assure proper coalescing of the solder
paste into liquid solder and the formation of good solder
connections. Beyond the recommended dwell time the in-
termetallic growth within the solder connections becomes
excessive, resulting in the formation of weak and unreli-
able connections. The temperature is then rapidly reduced
to a point below the solidus temperature of the solder to
allow the solder within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The cool
down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum.
This limitation is necessary to allow the PC board and
component pins to change dimensions evenly, putting
minimal stresses on the component.
It is recommended to perform reow soldering no more
than twice.
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