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參數(shù)資料
| 型號： | AQ1053N3S-T |
| 廠商： | TAIYO YUDEN CO LTD |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 0.0033 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封裝： | CHIP, 0402, ROHS COMPLIANT |
| 文件頁數(shù)： | 6/18頁 |
| 文件大?。?/td> | 863K |
| 代理商： | AQ1053N3S-T |
PRECAUTIONS
FERRITE
PRODUCTS
5
259
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
3/7
Technical considerations
Stages
Precautions
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed
on the inductors, causing damage. To avoid this, the following points should
be considered before lowering the pick-up nozzle:
1 The lower limit of the pick-up nozzle should be adjusted to the surface level of
the PC board after correcting for deection of the board.
2 The pick-up pressure should be adjusted between 1 and 3 N static loads.
3 To reduce the amount of deection of the board caused by impact of the
pick-up nozzle, supporting pins or back-up pins should be used under the PC
board. The following diagrams show some typical examples of good pick-up
nozzle placement:
Improper method
Proper method
2. As the alignment pin wears out, adjustment of the nozzle height can
cause chipping or cracking of the inductors because of mechanical im-
pact on the inductors. To avoid this, the monitoring of the width between
the alignment pin in the stopped position, and maintenance, inspection
and replacement of the pin should be conducted periodically.
Selection of Adhesives
1. Mounting inductors with adhesives in preliminary
assembly, before the soldering stage, may lead
to degraded inductor characteristics unless the
following factors are appropriately checked; the
size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening
period. Therefore, it is imperative to consult the
manufacturer of the adhesives on proper usage
and amounts of adhesive to use.
1. Some adhesives may cause reduced insulation resistance. The differ-
ence between the shrinkage percentage of the adhesive and that of the
inductors may result in stresses on the inductors and lead to cracking.
Moreover, too little or too much adhesive applied to the board may ad-
versely affect component placement, so the following precautions should
be noted in the application of adhesives.
1 Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during
the mounting & solder process.
b. The adhesive should have sufcient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
3.Considerations for
automatic placement
Adjustment of mounting machine
1. Excessive impact load should not be imposed on
the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter
should be conducted periodically.
Double-sided
mounting
Single-sided mounting
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
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