262
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
5/7
4.
1/2 1/3
100 130
20W
1
5.
1.
260
10
260
10
150
60
350
3
120
60
150
230
40
100
190
3216
130
3225
20W
1
300
200
100
0
300
200
100
0
400
300
200
100
0
Peak 260
max
10 sec max
Pb free soldering
Peak 260
max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
T190
3216Type max ,
130
3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1 or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature
300
200
100
0
Temperature
300
200
100
0
Temperature
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350
max
3 sec max
60 sec min
260
10
260
10
150
60
350
3
120
60
150
230
40
100
190
3216
130
3225
20W
1
300
200
100
0
300
200
100
0
400
300
200
100
0
Peak 260
max
10 sec max
Pb free soldering
Peak 260
max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
T190
3216Type max ,
130
3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1 or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature
300
200
100
0
Temperature
300
200
100
0
Temperature
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350
max
3 sec max
60 sec min
260
10
260
10
150
60
350
3
120
60
150
230
40
100
190
3216
130
3225
20W
1
300
200
100
0
300
200
100
0
400
300
200
100
0
Peak 260
max
10 sec max
Pb free soldering
Peak 260
max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
T190
3216Type max ,
130
3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1 or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature
300
200
100
0
Temperature
300
200
100
0
Temperature
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350
max
3 sec max
60 sec min