參數(shù)資料
型號： AQ1058N2J-T
廠商： TAIYO YUDEN CO LTD
元件分類： 通用定值電感
英文描述： 1 ELEMENT, 0.0082 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
封裝： CHIP, 0402, ROHS COMPLIANT
文件頁數(shù)： 8/18頁
文件大?。?/td> 863K
代理商： AQ1058N2J-T
PRECAUTIONS
FERRITE
PRODUCTS
5
263
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
5/7
Stages
Precautions
Technical considerations
4.Soldering
Recommended conditions for soldering
Reow soldering
Temperature prole
2. Because excessive dwell times can detrimentally affect solderability,
soldering duration should be kept as close to recommended times
as possible.
Wave soldering
Temperature prole
Caution
1. The ideal condition is to have solder mass
llet controlled to 1/2 to
1/3 of the thickness of the inductor, as shown below:
Caution
1. Make sure the inductors are preheated sufciently.
2. The temperature difference between the inductor and melted solder should
not be greater than 100 to 130
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for re-
ow soldering only.
Hand soldering
Temperature prole
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
Cleaning conditions
1. When cleaning the PC board after the Inductors are
all mounted, select the appropriate cleaning solu-
tion according to the type of flux used and pur-
pose of the cleaning e.g. to remove soldering ux
or other materials from the production process.
1. The use of inappropriate solutions can cause foreign substances such
as ux residue to adhere to the inductor, resulting in a degradation of the
inductor's electrical properties especially insulation resistance .
5.Cleaning
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
And please contact us about peak temperature
when you use lead-free paste.
260
10
260
10
150
60
350
3
120
60
150
230
40
100
190
3216
130
3225
20W
1
300
200
100
0
300
200
100
0
400
300
200
100
0
Peak 260
max
10 sec max
Pb free soldering
Peak 260
max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
T190
3216Type max ,
130
3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1 or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature
300
200
100
0
Temperature
300
200
100
0
Temperature
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350
max
3 sec max
60 sec min
260
10
260
10
150
60
350
3
120
60
150
230
40
100
190
3216
130
3225
20W
1
300
200
100
0
300
200
100
0
400
300
200
100
0
Peak 260
max
10 sec max
Pb free soldering
Peak 260
max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
T190
3216Type max ,
130
3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1 or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature
300
200
100
0
Temperature
300
200
100
0
Temperature
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350
max
3 sec max
60 sec min
260
10
260
10
150
60
350
3
120
60
150
230
40
100
190
3216
130
3225
20W
1
300
200
100
0
300
200
100
0
400
300
200
100
0
Peak 260
max
10 sec max
Pb free soldering
Peak 260
max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
T190
3216Type max ,
130
3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1 or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature
300
200
100
0
Temperature
300
200
100
0
Temperature
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350
max
3 sec max
60 sec min
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