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6. Cleaning solvents compatibility
Dip cleaning with an organic solvent is
recommended for removal of solder flux,
dust, etc. Select a cleaning solvent from
the following table. If ultrasonic cleaning
must be used, the severity of factors such
as frequency, output power and cleaning
solvent selected may cause loose wires
and other defects. Make sure these condi-
tions are correct before use. For details,
please consult us.
7. Others
(1) If an SSR is used in close proximity to
another SSR or heat-generating device,
its ambient temperature may exceed the
allowable level. Carefully plan SSR layout
and ventilation.
(2) Soldering to SSR terminals should be
completed within 5 seconds at 260
°
C.
(3) Terminal connections should be made
by referring to the associated wiring dia-
gram.
(4) For higher reliability, check device
quality under actual operating conditions.
8. Thermal Design
SSRs used in high-reliability equipment
require careful thermal design. In particu-
lar, junction temperature control has a sig-
nificant effect on device function and life
time. The rated load current for board-
mounting SSRs is defined as the maxi-
mum current possible at an ambient tem-
perature of 40
°
C (30
°
C) while allowing
natural cooling (self cooling). If the ambi-
ent temperature exceeds 40
°
C (30
°
C),
load current derating is necessary ac-
cording to the load current versus ambient
temperature curve. If adjacent devices act
as heat sources, the SSR should be locat-
ed more than 10 mm away from those de-
vices.
Cleaning solvent
Compatibility
H
: Yes
: No
Chlorine-
base
Trichlene
Chloroethlene
Indusco
Hollis
Lonco Terg
IPA
Ethanol
Thinner
Gasoline
H
Adueous
H
Alcohol-
base
H
Others
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