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參數(shù)資料
| 型號： | ARF1501 |
| 廠商： | Advanced Power Technology Ltd. |
| 英文描述： | ER 3C 3#16S SKT RECP |
| 中文描述： | 射頻功率MOSFET N溝道增強模式 |
| 文件頁數(shù)： | 2/2頁 |
| 文件大小： | 114K |
| 代理商： | ARF1501 |
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ARF1500
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dims: inches
HAZARDOUS MATERIAL
WARNING
The ceramic portion of the
device between leads and
mounting surface is beryllium
oxide. Beryllium oxide dust is
highly toxic when inhaled. Care
must be taken during handling
and mounting to avoid damage
to this area. These devices
must never be thrown away with
general industrial or domestic
waste.
Heat Sink
ARF 1500
Compliant
layer
Clamp
yyyy
Thermal Considerations and Package Mounting:
The rated 1500W power dissipation is only available when the package mounting
surface is at 25C and the junction temperature is 200C. The thermal resistance
between junctions and case mounting surface is 0.12 C/W. When installed, an addi-
tional thermal impedance of 0.09 C/W between the package base and the mounting
compound must be used to reduce the effects of small surface irregularities. The heat-
sink should incorporate a copper heat spreader to obtain best results.
The package is designed to be clamped to a heatsink. A clamped joint maintains the
required mounting pressure while allowing for thermal expansion of both the device
and the heat sink. A simple clamp, a compliant layer of plastic or rubber, and two 6-32
(M3.5) screws can provide the minimum 85 lb required mounting force. T = 6 in-lb.
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