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參數(shù)資料
| 型號： | AS218-321 |
| 廠商： | SKYWORKS SOLUTIONS INC |
| 元件分類： | 衰減器 |
| 英文描述： | PHEMT GaAs IC High Power Transfer Switch DC?6 GHz |
| 中文描述： | 100 MHz - 6000 MHz RF/MICROWAVE TRANSFER SWITCH, 1.8 dB INSERTION LOSS |
| 封裝： | QFN-12 |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 483K |
| 代理商： | AS218-321 |
Suggested PCB Land Pattern Designs for Leaded and Leadless Packages
and Detailed Surface Mount Guidelines for Leadless Packages
Skyworks Solutions, Inc.
[781] 376-3000
Fax
[781] 376-3100
Email
sales@skyworksinc.com
www.skyworksinc.com
Specifications subject to change without notice. 10/02A
5
Solder Mask Design
Two types of stencil designs are used for surface mount
packages:
1. Solder Mask Defined (SMD): Solder mask openings
smaller than metal pads.
2. Non-Solder Mask Defined (NSMD): Solder mask
openings larger than metal pads.
NSMD is recommended for the perimeter I/O lands, as this
allows the solder to wrap around the sides of the metal
pads on the board for a reliable solder joint.
Because the spacing between the ground pad and the
land pads can be small, SMD is recommended for the
ground pad to prevent solder bridging.
A stainless steel stencil, 0.125–0.150 mm (0.005–0.006")
thick, is recommended for solder paste application. For
better paste release, the aperture walls should be
trapezoidal and the corners rounded.
For the terminal lands, the stencil opening should be
0.05 mm larger than the PCB land (0.025 mm in each
direction).
For the ground pad area, it is recommended to screen the
solder paste in an array of small openings rather than one
large opening. The total (cumulative) area of all the
openings should be approximately equal to 50% of the
total ground pad area. This will ensure good solder
coverage with fewer voids. See Figure 3.
Solder Paste and Reflow Profile
Because leadless packages have a low stand-off height
and small terminal pitch, a No Clean, Type 3 solder paste,
and a convection/IR reflow is recommended.
Sn63 (63% Sn, 37% Pb) solder is preferred because it is
a eutectic compound with a melting point of 183°C.The
reflow temperature in this case would be above 183°C for
30–60 seconds, with a peak temperature of 205–210°C.
If a lead-free alloy is used, such as tin/silver or
tin/silver/copper, the melting point is 221°C and 217°C
respectively. In this case, the profile would be above
221/217°C for 30–60 seconds, with a peak temperature
of 230–240°C.Maximum temperature should not exceed
240°C.
A typical reflow profile is presented in Figure 4, which
could be used as a starting point.The actual profile used
will depend on the thermal mass of the entire populated
board and the solder compound used.
Multiple Small Stencil Openings
(Total Area Approximately 50% of
Total PCB Ground Pad)
PCB Ground
Pad Boundary
Terminal Land
Stencil Opening
Figure 3. Recommended Stencil Design
T
250
200
150
100
50
0
0
60
120
Time (Seconds)
180
240
300
Preheat Flux Activation/
Thermal Equalization
Reflow
Cool
Down
2–4 Minutes Max.
3
Minutes
Min.
<2.5C
Sec.
30–60
Sec.
<0.5–0.6C/Sec.
<1.3–1.6C/Sec.
Figure 4.Typical Solder Reflow Profile
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AS218-321LF | PHEMT GaAs IC High Power Transfer Switch DC?6 GHz |
| AS2201F-U01-04 | CONTROL ELBOW 4MM |
| AS2201F-U01-06 | CONTROL ELBOW 6MM |
| AS2201F-U01-08 | CONTROL ELBOW 8MM |
| AS2201F-U02-04 | CONTROL ELBOW 4MM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AS218-321LF | 功能描述:RF 開關(guān) IC .1-6.0GHz GaAs IL1.6dB RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| AS218-321LF-B | 制造商:Skyworks Solutions Inc 功能描述:RF AND MICROWAVE SWITCH |
| AS21870FLF | 制造商:TT Electronics / IRC 功能描述:AS21870FLF |
| AS21870HLF | 制造商:TT Electronics / IRC 功能描述:AS21870HLF |
| AS21870JLF | 制造商:TT Electronics / IRC 功能描述:AS21870JLF |
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