參數(shù)資料
型號(hào)： AS8530-ASOT-002-500
廠商： ams
文件頁(yè)數(shù)： 30/33頁(yè)
文件大?。?/td> 0K
描述： IC TXRX LIN COMPANION 8-SOIC
標(biāo)準(zhǔn)包裝： 500
系列： *
Revision 1.1
5 - 32
AS8530
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Electrical Parameters
DC Supply Voltage
VSUP
-0.3
42
V
Transient up to 500ms duration
EN
-0.3
VSUP +
0.3
V
VCC
-0.3
7
V
LIN
-27
+40
V
RESET, RX, TX
-0.3
VCC + 0.3
V
Input current (latchup immunity) Iscr
-100
100
mA
Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge (ESD)
Norm: AEC-Q-100-002
±2
kV
For on board signals VCC, TX, RX, Reset
±4
For VSUP
±6
LIN to VSS, HBM Model
Continuous Power Dissipation
Total operating power dissipation
(all supplies and outputs) Pt
0.25
W
epSOIC8 in still air, soldered on JEDEC standard
board @125 ambient, static operation = no time limit
Temperature Ranges and Storage Conditions
Storage temperature (Tstrg)
-55
+150
C
Package body temperature (Tbody)
+260
C
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte
tin (100% Sn).
Humidity non-condensing
5
85
%
Moisture Sensitive Level
3
Represents a maximum floor life time of 168h
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