23
1779ES–ATARM–14-Apr-06
AT91M42800A
10. Soldering Profile
10.1
LQFP Soldering Profile (Green)
Table 10-1 gives the recommended soldering profile from J-STD-020C.
Note:
The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
10.2
BGA Soldering Profile (RoHS-compliant)
Table 10-2 gives the recommended soldering profile from J-STD-20C.
Note:
It is recomended to apply a soldering temperature higher than 250°C.
A maximum of three reflow passes is allowed per component.
Table 10-1.
Soldering Profile Green Compliant Package
Profile Feature
Green Package
Average Ramp-up Rate (217°C to Peak)
3
° C/sec. max.
Preheat Temperature 175°C ±25°C
180 sec. max.
Temperature Maintained Above 217°C
60 sec. to 150 sec.
Time within 5
° C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260
° C
Ramp-down Rate
6
° C/sec. max.
Time 25
° C to Peak Temperature
8 min. max.
Table 10-2.
Soldering Profile RoHS Compliant Package
Profile Feature
Convection or IR/Convection
Average Ramp-up Rate (183
° C to Peak)
3
° C/sec. max.
Preheat Temperature 125
° C ±25° C
180 sec. max
Temperature Maintained Above 183
° C
60 sec. to 150 sec.
Time within 5
° C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260
° C
Ramp-down Rate
6
° C/sec.
Time 25
° C to Peak Temperature
8 min. max