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參數(shù)資料
| 型號： | ATS625LSGTN-T |
| 元件分類： | 速度傳感器和接近開關(guān) |
| 英文描述： | PROXIMITY SENSOR-HALL EFFECT, 0.5-2.5mm, 200-450mV, RECTANGULAR, THROUGH HOLE MOUNT |
| 封裝： | PLASTIC, SIP-4 |
| 文件頁數(shù)： | 10/21頁 |
| 文件大?。?/td> | 725K |
| 代理商： | ATS625LSGTN-T |
True Zero-Speed Low-Jitter High Accuracy
Gear Tooth Sensor IC
ATS625LSG
18
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating sup-
plied power or improving the heat dissipation properties of the
application. This section presents a procedure for correlating
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.)
The Package Thermal Resistance, RJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, RJC, is
relatively small component of RJA. Ambient air temperature,
TA, and air motion are significant external factors, damped by
overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN
× IIN
(1)
T = PD
× RJA (2)
TJ = TA + ΔT
(3)
For example, given common conditions such as: TA= 25°C,
VIN = 12 V, IIN = 4 mA, and RJA = 140 °C/W, then:
PD = VIN
× IIN = 12 V × 4 mA = 48 mW
T = PD
× RJA = 48 mW × 140 °C/W = 7°C
TJ = TA + T = 25°C + 7°C = 32°C
A worst-case estimate, PD(max), represents the maximum allow-
able power level, without exceeding TJ(max), at a selected RJA
and TA.
Example: Reliability for VCC at TA=150°C, package SG, using
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
RJA=126°C/W, TJ(max) =165°C, VCC(max)=26.5V, and
ICC(max) = 8 mA. Note that ICC(max) at TA=150°C is lower than
the ICC(max) at TA=25°C given in the Operating Characteristics
table.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
Tmax = TJ(max) – TA = 165°C–150°C = 15°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = Tmax÷RJA =15°C÷126 °C/W=119mW
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ÷ ICC(max)= 119mW÷8mA=14.9 V
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-
able operation between VCC(est) and VCC(max) requires enhanced
RJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ATS625LSGTN-T3 | 制造商:ALLEGRO 制造商全稱:Allegro MicroSystems 功能描述:True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor |
| ATS627LSG | 制造商:ALLEGRO 制造商全稱:Allegro MicroSystems 功能描述:True Zero Speed, Low Jitter, High Accuracy Position Sensor IC |
| ATS627LSGTN-T | 功能描述:IC HALL EFFECT GEAR SENSOR 4-SIP RoHS:是 類別:傳感器，轉(zhuǎn)換器 >> 磁性 - 霍爾效應(yīng)，數(shù)字式開關(guān)，線性，羅盤 (IC) 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 傳感范圍:20mT ~ 80mT 類型:旋轉(zhuǎn) 電源電壓:4.5 V ~ 5.5 V 電流 - 電源:15mA 電流 - 輸出（最大）:- 輸出類型:數(shù)字式，PWM，8.5 位串行 特點:可編程 工作溫度:-40°C ~ 150°C 封裝/外殼:20-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:20-SSOP 包裝:Digi-Reel® 其它名稱:AS5132-HSST-500DKR |
| ATS630LSA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
| ATS630LSB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
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